A Vertical Transition between Microstrip Line and Air-Filled SIW at Ka-band
| dc.rights.license | open | en_US |
| dc.contributor.author | ZHANG, Jingwen | |
| dc.contributor.author | DUROC, Yvan | |
| dc.contributor.author | WU, Ke | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | GHIOTTO, Anthony | |
| dc.contributor.author | VOUNG, Tan-Phu | |
| dc.date.accessioned | 2024-03-05T08:18:14Z | |
| dc.date.available | 2024-03-05T08:18:14Z | |
| dc.date.issued | 2022-09 | |
| dc.date.conference | 2022-09-27 | |
| dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/188586 | |
| dc.description.abstractEn | A low-loss vertical transition between microstrip line and air-filled substrate integrated waveguide (AFSIW) at Ka-band is proposed. The objective is to be able to connect active components based on microstrip technology with passive components based on AFSIW technology. The coupling between the quasi-TEM mode of the microstrip line and the TE10 mode of the AFSIW guide is carried out by a slot and a copper line placed on one layer of the substrate. To obtain reliable measurements, a back-to-back transition has been designed and fabricated. The measured results obtained show that over a frequency range of 27.5 GHz to 29.8 GHz the proposed transition has a reflection coefficient of between −10 dB and −15 dB and insertion losses between 0.78 dB and 1.45 dB. | |
| dc.language.iso | EN | en_US |
| dc.subject | Waveguide transitions | |
| dc.subject | Transmission lines | |
| dc.subject | Three-dimensional displays | |
| dc.subject | Waveguide components | |
| dc.subject | Insertion loss | |
| dc.subject | Loss measurement | |
| dc.subject | Reflection coefficient | |
| dc.subject | Air-filled substrate integrated waveguide (AFSIW) | |
| dc.subject | Microstrip | |
| dc.subject | Transition | |
| dc.subject | Ka-band | |
| dc.title.en | A Vertical Transition between Microstrip Line and Air-Filled SIW at Ka-band | |
| dc.type | Communication dans un congrès | en_US |
| dc.identifier.doi | 10.23919/EuMC54642.2022.9924415 | en_US |
| dc.subject.hal | Sciences de l'ingénieur [physics] | en_US |
| bordeaux.page | 484-487 | en_US |
| bordeaux.hal.laboratories | IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 | en_US |
| bordeaux.institution | Université de Bordeaux | en_US |
| bordeaux.institution | Bordeaux INP | en_US |
| bordeaux.institution | CNRS | en_US |
| bordeaux.conference.title | 2022 52nd European Microwave Conference (EuMC) | en_US |
| bordeaux.country | it | en_US |
| bordeaux.title.proceeding | 2022 52nd European Microwave Conference (EuMC) | en_US |
| bordeaux.team | CIRCUIT DESIGN-CSH | en_US |
| bordeaux.conference.city | Milan | en_US |
| hal.invited | oui | en_US |
| hal.proceedings | oui | en_US |
| hal.conference.end | 2022-09-29 | |
| hal.popular | non | en_US |
| hal.audience | Internationale | en_US |
| hal.export | false | |
| dc.rights.cc | Pas de Licence CC | en_US |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2022-09&rft.spage=484-487&rft.epage=484-487&rft.au=ZHANG,%20Jingwen&DUROC,%20Yvan&WU,%20Ke&GHIOTTO,%20Anthony&VOUNG,%20Tan-Phu&rft.genre=unknown |
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