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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorYANG, Yang
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorDEJOUS, Corinne
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorHALLIL, Hamida
dc.date.accessioned2024-01-16T08:52:02Z
dc.date.available2024-01-16T08:52:02Z
dc.date.issued2022-07
dc.date.conference2022-07-11
dc.identifier.issn1803-7232en_US
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/187254
dc.description.abstractEnThe film bulk acoustic resonator (FBAR) is an emerging piezoelectric device, widely spreading for sensing applications and in many commercial products like cell phones for its high working frequency and small size. This work presents a complete approach for the modeling and design of a ZnO-based Solidly Mounted Resonator (SMR) in 2D and 3D models. The finite element method was used to perform its simulation at the frequency range from 1 to 3 GHz. In addition, in order to suppress or minimize horizontal parasitic modes, the geometry of the electrodes has been optimized by comparing the pentagonal and the rectangular shapes. Finally, the size of the models has been reduced to save computing resources by setting symmetry boundary conditions.
dc.language.isoENen_US
dc.subjectGeometry
dc.subjectElectrodes
dc.subjectSolid modeling
dc.subjectThree-dimensional displays
dc.subjectShape
dc.subjectComputational modeling
dc.subjectResonant frequency
dc.subjectPiezoelectric transducers
dc.subjectPiezoelectric devices
dc.subjectSolidly Mounted Resonator
dc.subjectFinite Element Method
dc.subjectSensor application
dc.title.enA method of optimisation in modelling and design of solidly mounted resonator (SMR) by using Finite Element Method
dc.typeCommunication dans un congrèsen_US
dc.identifier.doi10.1109/DTIP56576.2022.9911747en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.page1-4en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.title2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)en_US
bordeaux.countryfren_US
bordeaux.title.proceeding2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)en_US
bordeaux.teamWAVES-MDAen_US
bordeaux.conference.cityPont-a-Moussonen_US
hal.invitedouien_US
hal.proceedingsouien_US
hal.conference.end2022-07-13
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exportfalse
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2022-07&rft.spage=1-4&rft.epage=1-4&rft.eissn=1803-7232&rft.issn=1803-7232&rft.au=YANG,%20Yang&DEJOUS,%20Corinne&HALLIL,%20Hamida&rft.genre=unknown


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