Mostrar el registro sencillo del ítem
A Simple Process for the Fabrication of Parallel-Plate Electrostatic MEMS Resonators by Gold Thermocompression Bonding
| dc.rights.license | open | en_US |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | JUAREZ, Dolores Manrique | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | MATHIEU, Fabrice | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | LIBAUDE, Guillaume | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | BOURRIER, David | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | CHARLOT, Samuel | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | MAZENQ, Laurent | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | CONEDERA, Veronique | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | SALVAGNAC, Ludovic | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | DUFOUR, Isabelle
IDREF: 069722633 | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| dc.contributor.author | NICU, Liviu | |
| hal.structure.identifier | Laboratoire d'analyse et d'architecture des systèmes [LAAS] | |
| hal.structure.identifier | School of Electrical and Computer Engineering - Georgia Insitute of Technology [ECE GeorgiaTech] | |
| hal.structure.identifier | Georgia Institute of Technology [Atlanta] | |
| dc.contributor.author | LEICHLE, Thierry | |
| dc.date.accessioned | 2023-11-28T10:33:10Z | |
| dc.date.available | 2023-11-28T10:33:10Z | |
| dc.date.issued | 2023-03-01 | |
| dc.date.conference | 2023-01-15 | |
| dc.identifier.issn | 2473-2001 | en_US |
| dc.identifier.uri | oai:crossref.org:10.1109/mems49605.2023.10052563 | |
| dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/186196 | |
| dc.description.abstract | The present work introduces a simple and quick process for the fabrication of flexural MEMS resonators with electrostatic actuation and capacitive detection. Gold thermocompression is used to anchor the free-standing structure, to provide electrical connections and to seal the chip to protect the structure to be released during wet etching, in a single step. The additional advantage of this process is the ability to simply adjust the gap of the parallel-plate capacitor through the thickness of electroplated gold. Squeeze damping is reduced by fabricating devices with increasing gaps. | |
| dc.language.iso | EN | en_US |
| dc.publisher | IEEE | en_US |
| dc.source | crossref | |
| dc.subject | Micromechanical devices | |
| dc.subject | Fabrication | |
| dc.subject | Damping | |
| dc.subject | Gold | |
| dc.subject | Wet etching | |
| dc.subject | Silicon carbide | |
| dc.subject | Resonators | |
| dc.subject | damping Electroplating | |
| dc.subject | Electrostatic actuators | |
| dc.subject | Etching | |
| dc.subject | Gold | |
| dc.subject | Lead bonding | |
| dc.subject | Micromechanical devices | |
| dc.subject | Micromechanical resonators | |
| dc.subject | Capacitors | |
| dc.subject | Micromechanical device | |
| dc.subject | Cantilever | |
| dc.subject | Parallel-plate capacitor | |
| dc.subject | Resonant frequency | |
| dc.subject | Q-factor | |
| dc.subject | Packaging | |
| dc.subject | Thermocompression | |
| dc.title.en | A Simple Process for the Fabrication of Parallel-Plate Electrostatic MEMS Resonators by Gold Thermocompression Bonding | |
| dc.type | Actes de congrès/Proceedings | en_US |
| dc.identifier.doi | 10.1109/mems49605.2023.10052563 | en_US |
| dc.subject.hal | Sciences de l'ingénieur [physics] | en_US |
| bordeaux.institution | Université de Bordeaux | en_US |
| bordeaux.institution | Bordeaux INP | en_US |
| bordeaux.institution | CNRS | en_US |
| bordeaux.conference.title | 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) | en_US |
| bordeaux.country | de | en_US |
| bordeaux.team | ORGANICS ELECTRONICS-PRIMS | en_US |
| bordeaux.conference.city | Munich | en_US |
| bordeaux.inpress | non | en_US |
| bordeaux.identifier.funderID | Agence Nationale pour la Gestion des Déchets Radioactifs | en_US |
| bordeaux.import.source | dissemin | |
| hal.conference.end | 2023-01-19 | |
| hal.popular | non | en_US |
| hal.audience | Internationale | en_US |
| hal.export | false | |
| workflow.import.source | dissemin | |
| dc.rights.cc | Pas de Licence CC | en_US |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2023-03-01&rft.eissn=2473-2001&rft.issn=2473-2001&rft.au=JUAREZ,%20Dolores%20Manrique&MATHIEU,%20Fabrice&LIBAUDE,%20Guillaume&BOURRIER,%20David&CHARLOT,%20Samuel&rft.genre=unknown |

