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hal.structure.identifierAxe 1 : procédés céramiques
dc.contributor.authorGEFFROY, Pierre-Marie
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorHEINTZ, Jean-Marc
dc.date.issued2011
dc.identifier.isbn978-953-307-150-3
dc.description.abstractEnCarbon fibres reinforced copper matrix composites (Cu/C composites) offer an excellentthermal conductivity and a low coefficient of thermal expansion. Then, these composites arecompromising heat dissipation materials for electronic application.The modern electronic devices consist of a variety of metallic, ceramic, plastic or compositecomponents. The large difference of coefficient of thermal expansion (CTE) between ceramicsubstrates, such as Al2O3 and AlN, and heat dissipation materials, such as Cu and Al, and Siand GaAs semiconductors, induces thermal stresses resulting in failures at the interfacesbetween the different layers of the devices (fig. 1). In high power dissipation packages,thermal management is an important issue to prevent thermal damage of sensitivecomponents on the silicon ship, especially for high density electronic packaging. Thermalmanagement is thus one of the critical aspects in design of multichip modules to ensurereliability of electronic devices with high packing and power densities. In this context, thereis an increasing demand of new heat dissipation materials having low CTE combined withhigh thermal conductivity, such as Cu/C composites.
dc.language.isoen
dc.publisherInTech
dc.publisher.locationRijeka, Croatia
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/
dc.source.titleAdvances in composite materials : ecodesign and analysis
dc.subject.enCarbon Fibre
dc.subject.enMatrix Composites
dc.subject.enCopper
dc.title.enElaboration and Properties of Carbon Fibre Reinforced Copper Matrix Composites
dc.typeChapitre d'ouvrage
dc.identifier.doi10.5772/14831
dc.subject.halChimie/Matériaux
bordeaux.page271-290
bordeaux.title.proceedingAdvances in composite materials : ecodesign and analysis
hal.identifierhal-04161548
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-04161548v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.btitle=Advances%20in%20composite%20materials%20:%20ecodesign%20and%20analysis&rft.date=2011&rft.spage=271-290&rft.epage=271-290&rft.au=GEFFROY,%20Pierre-Marie&SILVAIN,%20Jean-Fran%C3%A7ois&HEINTZ,%20Jean-Marc&rft.isbn=978-953-307-150-3&rft.genre=unknown


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