Elaboration and Properties of Carbon Fibre Reinforced Copper Matrix Composites
Langue
en
Chapitre d'ouvrage
Ce document a été publié dans
Advances in composite materials : ecodesign and analysis, Advances in composite materials : ecodesign and analysis. 2011p. 271-290
InTech
Résumé en anglais
Carbon fibres reinforced copper matrix composites (Cu/C composites) offer an excellentthermal conductivity and a low coefficient of thermal expansion. Then, these composites arecompromising heat dissipation materials for ...Lire la suite >
Carbon fibres reinforced copper matrix composites (Cu/C composites) offer an excellentthermal conductivity and a low coefficient of thermal expansion. Then, these composites arecompromising heat dissipation materials for electronic application.The modern electronic devices consist of a variety of metallic, ceramic, plastic or compositecomponents. The large difference of coefficient of thermal expansion (CTE) between ceramicsubstrates, such as Al2O3 and AlN, and heat dissipation materials, such as Cu and Al, and Siand GaAs semiconductors, induces thermal stresses resulting in failures at the interfacesbetween the different layers of the devices (fig. 1). In high power dissipation packages,thermal management is an important issue to prevent thermal damage of sensitivecomponents on the silicon ship, especially for high density electronic packaging. Thermalmanagement is thus one of the critical aspects in design of multichip modules to ensurereliability of electronic devices with high packing and power densities. In this context, thereis an increasing demand of new heat dissipation materials having low CTE combined withhigh thermal conductivity, such as Cu/C composites.< Réduire
Mots clés en anglais
Carbon Fibre
Matrix Composites
Copper
Origine
Importé de halUnités de recherche