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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorCOQUILLAS, Benjamin
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorKERHERVE, Eric
dc.contributor.authorAMIAUD, Anne-Charlotte
dc.contributor.authorREDOIS, Samuel
dc.contributor.authorROUSSEL, Laurent
dc.contributor.authorLOUIS, Bruno
dc.contributor.authorMERLET, Thomas
dc.contributor.authorPETIT, Vincent
dc.date.accessioned2023-06-06T12:45:54Z
dc.date.available2023-06-06T12:45:54Z
dc.date.issued2023-05-29
dc.identifier.issn1549-8328en_US
dc.identifier.urioai:crossref.org:10.1109/tcsi.2023.3274496
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/182503
dc.description.abstractEnThis paper presents a highly compact Ku band 130nm SiGe power amplifier (PA) in a double balanced architecture. A highly compact low-loss 4 to 1 combiner is associated with a cascode topology to provide a power combination up to 1W and a high resilience to the standing wave ratio (SWR) from 2:1 to 4:1. A high thermal stability up to 120 ∘ C is ensured by an advanced configuration of transistors. A choices innovative set on the cascode stage design and layout improves the control of the impact ionization and selfheating. A driver stage allows the circuit to achieve over 20 dB of linear gain. At 30 ∘ C, 18 GHz and a supply voltage (V SUPPLY) of 4.2V, this power amplifier achieves a measured saturated power (P sat) of 30 dBm for an output power at the 1dB compression point (OCP 1dB) of 28.8 dBm, a maximum power added efficiency (PAE) of 23.5% and a linear gain of 21.4 dB. The gain difference across 2:1 SWR phase variations is only 0.8 dB. The active area of the die chip is only 1.13 mm 2 .
dc.language.isoENen_US
dc.sourcecrossref
dc.subject.enBalanced architecture
dc.subject.enHigh output power
dc.subject.enKu band
dc.subject.enK band
dc.subject.enPower amplifier
dc.subject.enSiGe
dc.subject.enSWR-resilience
dc.subject.enThermal stability
dc.subject.enImpact ionization
dc.subject.enSelfheating
dc.subject.enAvalanche
dc.subject.enTransistors
dc.subject.enGain
dc.subject.enSilicon germanium
dc.subject.enPower measurement
dc.subject.enPower generation
dc.titleAmplificateur de puissance SiGe en bande Ku avec puissance de sortie élevée et robustesse SWR jusqu'à 120 °C
dc.title.enKu Band SiGe Power Amplifier With High Output Power and SWR Robustness Up to 120°C
dc.typeArticle de revueen_US
dc.identifier.doi10.1109/tcsi.2023.3274496en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.journalIEEE Transactions on Circuits and Systems I: Regular Papersen_US
bordeaux.page1-8en_US
bordeaux.volume70
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.issue7
bordeaux.institutionUniversité de Bordeaux
bordeaux.institutionBordeaux INP
bordeaux.institutionCNRS
bordeaux.peerReviewedouien_US
bordeaux.inpressnonen_US
bordeaux.import.sourcedissemin
hal.identifierhal-04119191
hal.version1
hal.date.transferred2023-06-06T12:54:34Z
hal.exporttrue
workflow.import.sourcedissemin
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.title=Amplificateur%20de%20puissance%20SiGe%20en%20bande%20Ku%20avec%20puissance%20de%20sortie%20%C3%A9lev%C3%A9e%20et%20robustesse%20SWR%20jusqu'%C3%A0%20120%20%C2%B0C&rft.atitle=Amplificateur%20de%20puissance%20SiGe%20en%20bande%20Ku%20avec%20puissance%20de%20sortie%20%C3%A9lev%C3%A9e%20et%20robustesse%20SWR%20jusqu'%C3%A0%20120%20%C2%B0C&rft.jtitle=IEEE%20Transactions%20on%20Circuits%20and%20Systems%20I:%20Regular%20Papers&rft.date=2023-05-29&rft.volume=70&rft.issue=7&rft.spage=1-8&rft.epage=1-8&rft.eissn=1549-8328&rft.issn=1549-8328&rft.au=COQUILLAS,%20Benjamin&KERHERVE,%20Eric&AMIAUD,%20Anne-Charlotte&REDOIS,%20Samuel&ROUSSEL,%20Laurent&rft.genre=article


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