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hal.structure.identifierDepartment of Materials Science and Engineering
hal.structure.identifierHigh Entropy Materials Center
hal.structure.identifierPhD. Program in Prospective Functional Materials Industry,
dc.contributor.authorLEE, Jhuo-Lun
hal.structure.identifierDepartment of Materials Science and Engineering
dc.contributor.authorWANG, Pei-Te
hal.structure.identifierHigh Entropy Materials Center
dc.contributor.authorLO, Kai-Chi
hal.structure.identifierDepartment of Materials Science and Engineering
dc.contributor.authorSHEN, Pai-Keng
hal.structure.identifierDepartment of Materials Science and Engineering
dc.contributor.authorTSOU, Nien-Ti
hal.structure.identifierDepartment of Mechanical Engineering
dc.contributor.authorKAKEHI, Koji
hal.structure.identifierResearch Center for Structural Materials
hal.structure.identifierDepartment of Nanoscience and Nanoengineering
dc.contributor.authorMURAKAMI, Hideyuki
hal.structure.identifierDepartment of Materials Science and Engineering
hal.structure.identifierHigh Entropy Materials Center
hal.structure.identifierPhD. Program in Prospective Functional Materials Industry,
dc.contributor.authorTSAI, Che-Wei
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorGORSSE, Stéphane
hal.structure.identifierDepartment of Materials Science and Engineering
hal.structure.identifierHigh Entropy Materials Center
hal.structure.identifierPhD. Program in Prospective Functional Materials Industry,
dc.contributor.authorYEH, An-Chou
dc.date.issued2023
dc.identifier.issn1468-6996
dc.description.abstractEnIn this study, tensile and creep deformation of a high-entropy alloy processed by selective laser melting (SLM) has been investigated; hot ductility drop was identified at first, and the loss of ductility at elevated temperature was associated with intergranular fracture. By modifying the grain boundary morphology from straight to serration, the hot ductility drop issue has been resolved successfully. The serrated grain boundary could be achieved by reducing the cooling rate of solution heat treatment, which allowed the coarsening of L12 structured γ′ precipitates to interfere with mobile grain boundaries, resulting in undulation of the grain boundary morphology. Tensile and creep tests at 650°C were conducted, and serrated grain boundary could render a significant increase in tensile fracture strain and creep rupture life by a factor of 3.5 and 400, respectively. Detailed microstructure analysis has indicated that serrated grain boundary could distribute strains more evenly than that of straight morphology. The underlying mechanism of deformation with grain boundary serration was further demonstrated by molecular dynamic simulation, which has indicated that serrated grain boundaries could reduce local strain concentration and provide resistance against intergranular cracking. This is the first study to tackle the hot ductility drop issue in a high-entropy alloy fabricated by SLM; it can provide a guideline to develop future high-entropy alloys and design post heat treatment for elevated temperature applications.
dc.language.isoen
dc.publisherNational Institute for Materials Science
dc.subject.enSelective laser melting
dc.subject.enhigh-entropy alloys
dc.subject.enhot ductility drops
dc.subject.entensile creep properties
dc.subject.enserrated grain boundary
dc.title.enEffect of serrated grain boundary on tensile and creep properties of a precipitation strengthened high entropy alloy
dc.typeArticle de revue
dc.identifier.doi10.1080/14686996.2022.2158043
dc.subject.halChimie/Matériaux
bordeaux.journalScience and Technology of Advanced Materials
bordeaux.page2158043 (13 p.)
bordeaux.volume24
bordeaux.issue1
bordeaux.peerReviewedoui
hal.identifierhal-03977402
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-03977402v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Science%20and%20Technology%20of%20Advanced%20Materials&rft.date=2023&rft.volume=24&rft.issue=1&rft.spage=2158043%20(13%20p.)&rft.epage=2158043%20(13%20p.)&rft.eissn=1468-6996&rft.issn=1468-6996&rft.au=LEE,%20Jhuo-Lun&WANG,%20Pei-Te&LO,%20Kai-Chi&SHEN,%20Pai-Keng&TSOU,%20Nien-Ti&rft.genre=article


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