Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction
dc.rights.license | open | en_US |
hal.structure.identifier | STMicrolectronics/MPU [MPU] | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
hal.structure.identifier | Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information [CEA-LETI] | |
dc.contributor.author | AYOUB, Bassel | |
hal.structure.identifier | STMicrolectronics/MPU [MPU] | |
dc.contributor.author | LHOSTIS, Sandrine | |
hal.structure.identifier | Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information [CEA-LETI] | |
dc.contributor.author | MOREAU, Stephane | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | HOUSSAINI, Faycal | |
hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
dc.contributor.author | FREMONT, Helene
IDREF: 127007571 | |
hal.structure.identifier | Institut des Matériaux, de Microélectronique et des Nanosciences de Provence [IM2NP] | |
dc.contributor.author | CORNELIUS, Thomas W. | |
hal.structure.identifier | Institut des Matériaux, de Microélectronique et des Nanosciences de Provence [IM2NP] | |
dc.contributor.author | THOMAS, Olivier | |
dc.date.accessioned | 2022-12-12T14:23:23Z | |
dc.date.available | 2022-12-12T14:23:23Z | |
dc.date.issued | 2022-10-12 | |
dc.date.conference | 2022-10-12 | |
dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/170574 | |
dc.description.abstractEn | The investigation of copper microstructure at nanoscale using synchrotron-based Laue microdiffraction technique is presented. Based on the experimental findings, FEM simulations allow to extract the plastic behaviour dependence on the orientation for the single crystals. The results obtained are used to achieve Cu/SiO2 hybrid bonding with 300 nm Cu pads. | |
dc.description.sponsorship | NANOELEC - ANR-10-AIRT-0005 | en_US |
dc.language.iso | EN | en_US |
dc.title.en | Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction | |
dc.type | Autre communication scientifique (congrès sans actes - poster - séminaire...) | en_US |
dc.subject.hal | Sciences de l'ingénieur [physics] | en_US |
bordeaux.hal.laboratories | IMS : Laboratoire d’Intégration du Matériau au Système - UMR 5218 | en_US |
bordeaux.institution | Université de Bordeaux | en_US |
bordeaux.institution | Bordeaux INP | en_US |
bordeaux.institution | CNRS | en_US |
bordeaux.conference.title | Satellite European School for Young Scientists Microscopy and Materials Characterization | en_US |
bordeaux.country | de | en_US |
bordeaux.title.proceeding | Satellite European School for Young Scientists Microscopy and Materials Characterization | |
bordeaux.conference.city | Dresde | en_US |
bordeaux.peerReviewed | oui | en_US |
bordeaux.identifier.funderID | Horizon 2020 | en_US |
hal.identifier | hal-03962892 | |
hal.version | 1 | |
hal.date.transferred | 2023-11-10T08:15:41Z | |
hal.export | true | |
dc.rights.cc | Pas de Licence CC | en_US |
bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2022-10-12&rft.au=AYOUB,%20Bassel&LHOSTIS,%20Sandrine&MOREAU,%20Stephane&HOUSSAINI,%20Faycal&FREMONT,%20Helene&rft.genre=conference |