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hal.structure.identifierElectronic Engineering Department
dc.contributor.authorALTET, J.
hal.structure.identifierElectronic Engineering Department
dc.contributor.authorALDRETE-VIDRIO, E.
hal.structure.identifierElectronic Engineering Department
dc.contributor.authorREVERTER, F.
hal.structure.identifierElectronic Engineering Department
dc.contributor.authorGOMEZ, D.
dc.contributor.authorGONZALEZ, J.L.
hal.structure.identifierAnalog and Mixed Signal Center [AMSC]
dc.contributor.authorONABAJO, M.
hal.structure.identifierAnalog and Mixed Signal Center [AMSC]
dc.contributor.authorSILVA-MARTINEZ, J.
hal.structure.identifierSTMicroelectronics
dc.contributor.authorMARTINEAU, B.
hal.structure.identifierCentre Nacional de Microelectrònica [CNM]
dc.contributor.authorPERPINÀ, X.
hal.structure.identifierTechniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés [TIMA]
dc.contributor.authorABDALLAH, L.
hal.structure.identifierTechniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés [TIMA]
dc.contributor.authorSTRATIGOPOULOS, Haralampos-G
dc.contributor.authorARAGONÈS, X.
hal.structure.identifierCentre Nacional de Microelectrònica [CNM]
dc.contributor.authorJORDÀ, X.
hal.structure.identifierCentre Nacional de Microelectrònica [CNM]
dc.contributor.authorVELLVEHI, M.
hal.structure.identifierLaboratoire Ondes et Matière d'Aquitaine [LOMA]
dc.contributor.authorDILHAIRE, S.
hal.structure.identifierTechniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés [TIMA]
dc.contributor.authorMIR, Salvador
hal.structure.identifierElectronic Engineering Department
dc.contributor.authorMATEO, D.
dc.date.issued2014
dc.date.conference2014-08-03
dc.description.abstractEnThis paper presents an overview of the work done so far related to the use of temperature sensors as performance monitors for RF and MMW circuits with the goal to implement built-in testing or self-calibration techniques. The strategy is to embed small temperature sensors on the same silicon die as the circuit under test, taking advantage of empty spaces in the layout. This paper reviews the physical principles, and presents examples that reveal how temperature sensors can be used as functional built-in testers serving to reduce testing costs and enhance yield as part of self-healing strategies.
dc.language.isoen
dc.publisherIEEE Computer Society
dc.subject.enbuilt in testing
dc.subject.entemperature sensors
dc.title.enReview of temperature sensors as monitors for RF mmW built-in testing and self-calibration schemes
dc.typeCommunication dans un congrès
dc.identifier.doi10.1109/MWSCAS.2014.6908606
dc.subject.halSciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique
bordeaux.page1081-1084
bordeaux.conference.title57th IEEE Midwest Symposium on Circuits and Systems (MWSCAS'14)
bordeaux.countryUS
bordeaux.conference.cityTexas
bordeaux.peerReviewedoui
hal.identifierhal-01118149
hal.version1
hal.invitednon
hal.proceedingsoui
hal.conference.end2014-08-06
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01118149v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2014&rft.spage=1081-1084&rft.epage=1081-1084&rft.au=ALTET,%20J.&ALDRETE-VIDRIO,%20E.&REVERTER,%20F.&GOMEZ,%20D.&GONZALEZ,%20J.L.&rft.genre=unknown


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