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Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality
hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
dc.contributor.author | DILHAIRE, S. | |
dc.contributor.author | CORNET, A. | |
dc.contributor.author | SCHAUB, E. | |
dc.contributor.author | RAUZAN, C. | |
hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
dc.contributor.author | CLAEYS, W. | |
dc.date.issued | 1998 | |
dc.date.conference | 1998 | |
dc.description.abstractEn | no abstract | |
dc.language.iso | en | |
dc.publisher | Pergamon-Elsevier Science Ltd | |
dc.title.en | Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality | |
dc.type | Communication dans un congrès | |
dc.subject.hal | Physique [physics] | |
bordeaux.page | 1293-1296 | |
bordeaux.country | ZZ | |
bordeaux.conference.city | Unknown | |
bordeaux.peerReviewed | oui | |
hal.identifier | hal-01550279 | |
hal.version | 1 | |
hal.invited | non | |
hal.proceedings | oui | |
hal.popular | non | |
hal.audience | Internationale | |
hal.origin.link | https://hal.archives-ouvertes.fr//hal-01550279v1 | |
bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=1998&rft.spage=1293-1296&rft.epage=1293-1296&rft.au=DILHAIRE,%20S.&CORNET,%20A.&SCHAUB,%20E.&RAUZAN,%20C.&CLAEYS,%20W.&rft.genre=unknown |
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