Thermal coupling in integrated circuits: Application to thermal testing
| hal.structure.identifier | Department of Electronic Engineering | |
| dc.contributor.author | ALTET, J. | |
| hal.structure.identifier | Department of Electronic Engineering | |
| dc.contributor.author | RUBIO, A. | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | SCHAUB, Emmanuel | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | DILHAIRE, S. | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | CLAEYS, W. | |
| dc.date.issued | 2001-01 | |
| dc.identifier.issn | 0018-9200 | |
| dc.description.abstractEn | The power dissipated by the devices of a circuit can be construed as a signature of the circuit's performance and state. Without disturbing the circuit operation, this power consumption can be monitored by temperature measurements of the silicon die surface via built-in differential temperature sensors. In this paper, dynamic and spatial thermal behavioral characterization of VLSI MOS devices is presented using laser thermoreflectance measurements and on-chip differential temperature sensing circuits. A discussion of the application of built-in differential temperature measurements as an IC test strategy is also presented. | |
| dc.language.iso | en | |
| dc.publisher | Institute of Electrical and Electronics Engineers | |
| dc.title.en | Thermal coupling in integrated circuits: Application to thermal testing | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1109/4.896232 | |
| dc.subject.hal | Physique [physics] | |
| bordeaux.journal | IEEE Journal of Solid-State Circuits | |
| bordeaux.page | 81-91 | |
| bordeaux.volume | 36 | |
| bordeaux.issue | 1 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-01550679 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Internationale | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-01550679v1 | |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=IEEE%20Journal%20of%20Solid-State%20Circuits&rft.date=2001-01&rft.volume=36&rft.issue=1&rft.spage=81-91&rft.epage=81-91&rft.eissn=0018-9200&rft.issn=0018-9200&rft.au=ALTET,%20J.&RUBIO,%20A.&SCHAUB,%20Emmanuel&DILHAIRE,%20S.&CLAEYS,%20W.&rft.genre=article |
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