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hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorGIROIRE, Baptiste
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorALI AHMAD, Mohamed
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorAUBERT, Guillaume
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorTEULÉ-GAY, Lionel
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorMICHAU, Dominique
hal.structure.identifierPolymer Science and Engineering Department
dc.contributor.authorWATKINS, James J.
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorAYMONIER, Cyril
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorPOULON-QUINTIN, Angeline
dc.date.issued2017
dc.identifier.issn0040-6090
dc.description.abstractEnA comparison of crystallinity, microstructure, surface morphology and electrical conductivity is proposed for the deposition of copper films, using supercritical fluid chemical deposition (SFCD) and RF magnetron sputtering techniques. Both preparation methods yield nanocrystalline Cu films (< 100 nm) but SFCD gives access to a higher crystallinity for the same AlN substrate temperature during the deposit. Based on the film characteristics, a comparison of the evolution of electrical properties is done for RF magnetron sputtered copper films and SFCD ones with H2 as reducing agent. Uniform strain values are significantly reduced when SFCD technique is used and crystallinity is highly increased leading to lower resistivity values for a same crystallite size. This study demonstrates the viability of the SFCD technique to produce high quality nanostructured copper thin films with low resistivity values.
dc.language.isoen
dc.publisherElsevier
dc.subject.enSupercritical fluid chemical deposition
dc.subject.enCopper
dc.subject.enThin films
dc.subject.enSputtering
dc.subject.enResistivity
dc.subject.enMicrostructure
dc.title.enA comparative study of copper thin films deposited using magnetron sputtering and supercritical fluid deposition techniques
dc.typeArticle de revue
dc.identifier.doi10.1016/j.tsf.2017.09.002
dc.subject.halChimie/Matériaux
bordeaux.journalThin Solid Films
bordeaux.page53-59
bordeaux.volume643
bordeaux.peerReviewedoui
hal.identifierhal-01652547
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01652547v1
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