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Preparation of Ni–YSZ thin and thick films on metallic interconnects as cell supports. Applications as anode for SOFC

hal.structure.identifierCentre interuniversitaire de recherche et d'ingénierie des matériaux [CIRIMAT]
dc.contributor.authorRIEU, Mathilde
hal.structure.identifierCentre interuniversitaire de recherche et d'ingénierie des matériaux [CIRIMAT]
dc.contributor.authorLENORMAND, Pascal
hal.structure.identifierCentre interuniversitaire de recherche et d'ingénierie des matériaux [CIRIMAT]
dc.contributor.authorANSART, Florence
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorMAUVY, Fabrice
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorFULLENWARTH, Julien
hal.structure.identifierEuropean Institute For Energy Research [EIFER]
dc.contributor.authorZAHID, Mohsine
dc.date.issued2008
dc.identifier.issn0928-0707
dc.description.abstractEnIn this work, we propose the preparation of a duplex anodic layer composed of both a thin (100 nm) and a thick film (10 μm) with Ni–YSZ material. The support of this anode is a metallic substrate, which is the interconnect of the SOFC unit cell. The metallic support limits the temperature of thermal treatment at 800 °C to keep a good interconnect mechanical behaviour and to reduce corrosion. We have chosen to elaborate anodic coatings by sol–gel route coupled with dip-coating process, which are low cost techniques and allow working with moderate temperatures. Thin films are obtained by dipping interconnect substrate into a sol, and thick films into an optimized slurry. After thermal treatment at only 800 °C, anodic coatings are adherent and homogeneous. Thin films have compact microstructures that confer ceramic protective barrier on metal surface. Further coatings of 10 μm thick are porous and constitute the active anodic material.
dc.language.isoen
dc.publisherSpringer Verlag
dc.subject.enNi–YSZ
dc.subject.enAnode
dc.subject.enSOFC
dc.subject.enSol–gel
dc.subject.enCoatings
dc.title.enPreparation of Ni–YSZ thin and thick films on metallic interconnects as cell supports. Applications as anode for SOFC
dc.typeArticle de revue
dc.identifier.doi10.1007/s10971-008-1689-0
dc.subject.halChimie/Matériaux
bordeaux.journalJournal of Sol-Gel Science and Technology
bordeaux.page307-313
bordeaux.volume45
bordeaux.issue3
bordeaux.peerReviewedoui
hal.identifierhal-00282103
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00282103v1
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