RIEU, Mathilde; LENORMAND, Pascal; ANSART, Florence; MAUVY, Fabrice; FULLENWARTH, Julien; ZAHID, Mohsine

doi:10.1007/s10971-008-1689-0

Metadatos

Mostrar el registro completo del ítem

Licencia de uso del documento

RIEU, Mathilde
Centre interuniversitaire de recherche et d'ingénierie des matériaux [CIRIMAT]

LENORMAND, Pascal
Centre interuniversitaire de recherche et d'ingénierie des matériaux [CIRIMAT]

ANSART, Florence
Centre interuniversitaire de recherche et d'ingénierie des matériaux [CIRIMAT]

Idioma

Article de revue

Este ítem está publicado en

Journal of Sol-Gel Science and Technology. 2008, vol. 45, n° 3, p. 307-313

Springer Verlag

Resumen en inglés

In this work, we propose the preparation of a duplex anodic layer composed of both a thin (100 nm) and a thick film (10 μm) with Ni–YSZ material. The support of this anode is a metallic substrate, which is the interconnect of the SOFC unit cell. The metallic support limits the temperature of thermal treatment at 800 °C to keep a good interconnect mechanical behaviour and to reduce corrosion. We have chosen to elaborate anodic coatings by sol–gel route coupled with dip-coating process, which are low cost techniques and allow working with moderate temperatures. Thin films are obtained by dipping interconnect substrate into a sol, and thick films into an optimized slurry. After thermal treatment at only 800 °C, anodic coatings are adherent and homogeneous. Thin films have compact microstructures that confer ceramic protective barrier on metal surface. Further coatings of 10 μm thick are porous and constitute the active anodic material.< Leer menos

Palabras clave en inglés

Ni–YSZ

Anode

SOFC

Sol–gel

Coatings

Metadatos

Licencia de uso del documento

Preparation of Ni–YSZ thin and thick films on metallic interconnects as cell supports. Applications as anode for SOFC

Idioma

Este ítem está publicado en

Resumen en inglés

Palabras clave en inglés

DOI

Orígen

Centros de investigación