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Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers

hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorFAN, Lisha
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorZHOU, Yunshen
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorWANG, Mengmeng
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorLU, Yongfeng
dc.date.issued2017
dc.identifier.issn0040-6090
dc.description.abstractEnWe demonstrate that femtosecond (fs) laser patterning of Cu can be exploited to realize seed-free deposition of large-area adhesive diamond films on Cu. Fs-laser-induced nanostructures promote diamond nucleation density and result in diamond film formation within a laser fluence window from 2.6 to 3.6 J cm− 2. Diamond films deposited on Cu surfaces prepared outside this window experience either complete film detachment or formation of low-quality ball-like diamond grains. Diamond/substrate interface roughness plays a critical role in controlling diamond quality and adhesion between substrates and diamond films. Large-area adhesive diamond films have been achieved on Cu substrate surfaces that were first modified with fs-laser irradiation and then scribed into grid patterns. The scribed channels function as expansion joints for stress relief. Strain-free diamond films have been achieved by optimizing the grid size. Using fs-laser processing for seed-free deposition of large-area diamond films on Cu is of great significance for diverse applications, such as thermal management and power electronic devices.
dc.language.isoen
dc.publisherElsevier
dc.subject.enDiamond
dc.subject.enCopper
dc.subject.enThin film
dc.subject.enFemtosecond laser processing
dc.title.enSeed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers
dc.typeArticle de revue
dc.identifier.doi10.1016/j.tsf.2017.06.058
dc.subject.halChimie/Matériaux
bordeaux.journalThin Solid Films
bordeaux.page499-505
bordeaux.volume636
bordeaux.peerReviewedoui
hal.identifierhal-01569398
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01569398v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Thin%20Solid%20Films&rft.date=2017&rft.volume=636&rft.spage=499-505&rft.epage=499-505&rft.eissn=0040-6090&rft.issn=0040-6090&rft.au=FAN,%20Lisha&ZHOU,%20Yunshen&WANG,%20Mengmeng&SILVAIN,%20Jean-Fran%C3%A7ois&LU,%20Yongfeng&rft.genre=article


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