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The role of controlled interfaces in the thermal management of copper-carbon composites

hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorVEILLERE, Amélie
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorHEINTZ, Jean-Marc
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorVINCENT, Cécile
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierDepartment of Mechanical and Materials Engineering
dc.contributor.authorGUILLEMET, Thomas
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorLACOMBE, Guillaume
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorLU, Yongfeng
hal.structure.identifierDepartment of Mechanical and Materials Engineering
dc.contributor.authorCHANDRA, Namas
dc.date.issued2012
dc.identifier.issn2046-0155
dc.description.abstractEnThe increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal- expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers, carbon nano fibers and diamond-reinforced copper matrix composites among them are considered very promising as a next generation of thermal-management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon composite films by powder metallurgy and tape casting and hot pressing; these films promise to be efficient heat-dissipation layers for power electronic modules. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermomechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between copper and carbon, enhancing all the desired thermal properties while minimizing the deleterious effect. In this paper, a variety of methods that are system specific that achieve these goals are outlined.
dc.language.isoen
dc.publisherEmerald Publishing
dc.subject.enThermal properties
dc.subject.enMaterial processing
dc.subject.enComposite materials
dc.title.enThe role of controlled interfaces in the thermal management of copper-carbon composites
dc.typeArticle de revue
dc.identifier.doi10.1680/emr.11.00016
dc.subject.halSciences de l'ingénieur [physics]/Matériaux
bordeaux.journalEmerging Materials Research
bordeaux.page75-87
bordeaux.volume1
bordeaux.issue2
bordeaux.peerReviewedoui
hal.identifierhal-00694213
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00694213v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Emerging%20Materials%20Research&rft.date=2012&rft.volume=1&rft.issue=2&rft.spage=75-87&rft.epage=75-87&rft.eissn=2046-0155&rft.issn=2046-0155&rft.au=SILVAIN,%20Jean-Fran%C3%A7ois&VEILLERE,%20Am%C3%A9lie&HEINTZ,%20Jean-Marc&VINCENT,%20C%C3%A9cile&GUILLEMET,%20Thomas&rft.genre=article


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