The role of controlled interfaces in the thermal management of copper-carbon composites
GUILLEMET, Thomas
Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Department of Mechanical and Materials Engineering
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Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
Department of Mechanical and Materials Engineering
Langue
en
Article de revue
Ce document a été publié dans
Emerging Materials Research. 2012, vol. 1, n° 2, p. 75-87
Emerald Publishing
Résumé en anglais
The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal- expansion ...Lire la suite >
The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials, with high thermal conductivity and thermal- expansion coefficient compatible with chip materials still ensuring the reliability of the power modules. In this context, metal matrix composites: carbon fibers, carbon nano fibers and diamond-reinforced copper matrix composites among them are considered very promising as a next generation of thermal-management materials in power electronic packages. These composites exhibit enhanced thermal properties compared to pure copper combined with lower density. This article presents the fabrication techniques of copper/carbon composite films by powder metallurgy and tape casting and hot pressing; these films promise to be efficient heat-dissipation layers for power electronic modules. The thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermomechanical properties. Interfaces (through novel chemical and processing methods), when selected carefully and processed properly will form the right chemical/mechanical link between copper and carbon, enhancing all the desired thermal properties while minimizing the deleterious effect. In this paper, a variety of methods that are system specific that achieve these goals are outlined.< Réduire
Mots clés en anglais
Thermal properties
Material processing
Composite materials
Origine
Importé de halUnités de recherche