2D Model for moisture diffusion in integrated Low-k dielectrics
| dc.rights.license | open | en_US |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | MISCHLER, Leo | |
| hal.structure.identifier | STMicroelectronics [Crolles] [ST-CROLLES] | |
| dc.contributor.author | CARTAILLER, Vivien | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | DUCHAMP, Genevieve
IDREF: 033689849 | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | FREMONT, Helene
IDREF: 127007571 | |
| hal.structure.identifier | STMicroelectronics [Crolles] [ST-CROLLES] | |
| dc.contributor.author | IMBERT, Gregory | |
| hal.structure.identifier | STMicroelectronics [Crolles] [ST-CROLLES] | |
| dc.contributor.author | MOULARD, J. | |
| hal.structure.identifier | STMicroelectronics [Crolles] [ST-CROLLES] | |
| dc.contributor.author | KERMARREC, Olivier | |
| dc.date.accessioned | 2022-07-11T09:04:05Z | |
| dc.date.available | 2022-07-11T09:04:05Z | |
| dc.date.issued | 2022 | |
| dc.date.conference | 2022-04-25 | |
| dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/140420 | |
| dc.description.abstractEn | This work presents a study of moisture diffusion inside integrated circuits. The targeted materials are low-k and SiCN dielectrics. Moisture diffusion in these two materials is studied through mass variations. In an integrated configuration, moisture penetration is monitored by capacitance variations. A 2D numerical simulation approach is presented to model the capacitance results using the bulk material properties as inputs. | |
| dc.language.iso | EN | en_US |
| dc.publisher | IEEE | en_US |
| dc.subject.en | Micromechanical devices | |
| dc.subject.en | Moisture | |
| dc.subject.en | Capacitance | |
| dc.subject.en | Numerical simulation | |
| dc.subject.en | Numerical models | |
| dc.subject.en | Dielectrics | |
| dc.subject.en | Microelectronics | |
| dc.title.en | 2D Model for moisture diffusion in integrated Low-k dielectrics | |
| dc.type | Communication dans un congrès avec actes | en_US |
| dc.identifier.doi | 10.1109/EuroSimE54907.2022.9758882 | en_US |
| dc.subject.hal | Sciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique | en_US |
| bordeaux.page | 1-6 | en_US |
| bordeaux.hal.laboratories | Laboratoire d’Intégration du Matériau au Système (IMS) - UMR 5218 | en_US |
| bordeaux.institution | Université de Bordeaux | en_US |
| bordeaux.institution | Bordeaux INP | en_US |
| bordeaux.institution | CNRS | en_US |
| bordeaux.conference.title | International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | en_US |
| bordeaux.country | mt | en_US |
| bordeaux.title.proceeding | 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | en_US |
| bordeaux.conference.city | St Julian | en_US |
| bordeaux.peerReviewed | oui | en_US |
| bordeaux.import.source | hal | |
| hal.identifier | hal-03666398 | |
| hal.version | 1 | |
| hal.export | false | |
| workflow.import.source | hal | |
| dc.rights.cc | Pas de Licence CC | en_US |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2022&rft.spage=1-6&rft.epage=1-6&rft.au=MISCHLER,%20Leo&CARTAILLER,%20Vivien&DUCHAMP,%20Genevieve&FREMONT,%20Helene&IMBERT,%20Gregory&rft.genre=proceeding |
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