Superhydrophobic, highly adhesive arrays of copper hollow spheres produced by electro-colloidal lithography
hal.structure.identifier | Centre de Recherche Paul Pascal [CRPP] | |
dc.contributor.author | BAZIN, Damien | |
hal.structure.identifier | Chimie et Biologie des Membranes et des Nanoobjets [CBMN] | |
dc.contributor.author | FAURE, Chrystel | |
dc.date.accessioned | 2020-07-09T14:17:16Z | |
dc.date.available | 2020-07-09T14:17:16Z | |
dc.date.issued | 2017-09 | |
dc.identifier.issn | 1744-683X | |
dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/10364 | |
dc.description.abstractEn | We report the patterning of copper surfaces which display both superhydrophobicity and high adhesion thanks to a new feature geometry, and without resorting to chemical modification. Polystyrene beads organized in 2D crystals under an AC electric field act as a template for the growth of copper deposited via cupric ion-loaded multi-lamellar vesicles. After the removal of the beads, hexagonal arrays of supported hollow spheres or copper bowls are generated, depending on the amount of deposited copper. While the bowl-covered surfaces display a predictable decreasing wettability (Cassie model) as their wall height increases, the hollow sphere-covered surfaces exhibit both high adhesion and superhydrophobicity (Cassie-Baxter state). | |
dc.title.en | Superhydrophobic, highly adhesive arrays of copper hollow spheres produced by electro-colloidal lithography | |
dc.type | Article de revue | |
dc.identifier.doi | 10.1039/c7sm01256j | |
dc.subject.hal | Chimie/Matériaux | |
bordeaux.journal | Soft Matter | |
bordeaux.page | 5500-5505 | |
bordeaux.volume | 13 | |
bordeaux.hal.laboratories | Institut de Chimie & de Biologie des Membranes & des Nano-objets (CBMN) - UMR 5248 | * |
bordeaux.hal.laboratories | Institut de Chimie & de Biologie des Membranes & des Nano-objets (CBMN, UMR 5248) | |
bordeaux.issue | 33 | |
bordeaux.institution | Université de Bordeaux | |
bordeaux.institution | Bordeaux INP | |
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