Recherche
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In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
(Microelectronic Engineering. vol. 261, pp. 111809, 2022-05)Article de revue -
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects
(2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)Communication dans un congrès avec actes