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QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms
(2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 72nd Electronic Components and Technology Conference (ECTC), us, San Diego, 2022-05-01)Communication dans un congrès avec actes -
Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès -
Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test
Communication dans un congrès