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In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
(Microelectronic Engineering. vol. 261, pp. 111809, 2022-05)Article de revue -
Screen-Printed Microcantilevers Coated with Functionalized Mesocellular Foam Silica for Detection of Solvent Vapors
(IEEE Sensors Journal. pp. 1-1, 2022-01-01)Article de revue -
Dual-Rate Control Framework With Safe Watermarking Against Deception Attacks
(IEEE Transactions on Systems, Man, and Cybernetics: Systems. pp. 1-13, 2022-01)Article de revue -
A Novel JFG Detection-Decoding Approach of a Vertical Shuffle Scheduling for Iterative MIMO Receivers with NB-LDPC Codes
(Signal Processing. vol. 190, pp. 108287, 2021-08)Article de revue -
Robust Design of an Anticipative Feedforward-feedback Controller for MIMO Systems
(International Journal of Control, Automation and Systems. vol. 20, n° 3, pp. 924-940, 2022-03)Article de revue -
ADP-based intelligent tracking algorithm for reentry vehicles subjected to model and state uncertainties
(IEEE Transactions on Industrial Informatics. pp. 1-1, 2022)Article de revue -
Dynamics of the corrosion for SAC305 solder alloy in salt environment
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes -
Degraded situation awareness in a robotic workspace: accident report analysis
(Theoretical Issues in Ergonomics Science. pp. 60-79, 2021-02)Article de revue -
Partial Differential Equations with Spatially Variable Coefficients
(Springer International Publishing, 2022-01)Chapitre d'ouvrage -
2D Model for moisture diffusion in integrated Low-k dielectrics
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes