Listar IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 por autor "NGUYEN, P."
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QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms
BEN ROMDHANE, E.; ROUMANILLE, P.; GUEDON-GRACIA, Alexandrine ...(2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 72nd Electronic Components and Technology Conference (ECTC), us, San Diego, 2022-05-01)Communication dans un congrès avec actes -
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
ROMDHANE, E. Ben; ROUMANILLE, P.; GUEDON-GRACIA, A. ...(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes