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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorMAHAUT, Victor
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorDUBOIS, Tristan
IDREF: 139527613
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorGRACIA, Alexandrine
IDREF: 091970490
dc.contributor.authorMAIA, Wilson
dc.date.accessioned2025-11-03T08:03:35Z
dc.date.available2025-11-03T08:03:35Z
dc.date.issued2025-05-27
dc.date.conference2025-05-27
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/207886
dc.description.abstractEnThis paper presents an assessment of electromagnetic attenuation at the board level over a frequency range of 1 MHz to 8.5 GHz, utilizing two materials: copper, used as a reference, and Continuous Carbon Fibers (CCF), an innovative composite material produced by Fused Deposition Modeling (FDM). Various measurement techniques, including TEM and GTEM cells, Mode-Stirred Reverberation Chamber (MSRC), and near-field probes, were employed to evaluate the attenuation characteristics. Experimental results indicated that while copper offers superior attenuation consistently across the frequency range, CCF demonstrated significant attenuation in specific frequency bands, making it a promising shielding solution. The potential of CCF is further enhanced by its mechanical properties, light weight, and the fabrication flexibility offered by the FDM process. Detailed material characterization was performed, revealing the composition and structural properties of the CCF filament. FEM simulations, coupled with experimental data, allowed for the identification of the most relevant electromagnetic attenuation characterization techniques for this specific test vehicle by confirming the hypotheses established after measurement. The influence of the guard ring design on the overall attenuation performance was also extensively analyzed through FEM simulations, underscoring the importance of optimized via layout and grounding connections to enhance attenuation, with a focus on the waveguide-below-cutoff principle. Furthermore, the simulations enabled the modeling of the CCF material, paving the way for exploring its electromagnetic performance in various applications. This study provides valuable insights for the design of electromagnetic shields using both traditional and innovative materials, offering potential improvements in the performance and versatility of board-level shielding solutions.
dc.language.isoENen_US
dc.subject.enBoard Level Shield
dc.subject.enAdditive manufacturing
dc.subject.enCarbon composite
dc.title.enAssessment of Electromagnetic Board Level Shielding Using Continuous Carbon Fiber
dc.typeCommunication dans un congrèsen_US
dc.identifier.doi10.1109/ectc51687.2025.00364en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.page2133-2139en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.titleElectronic Components and Technology Conference (ECTC) 2025en_US
bordeaux.countryusen_US
bordeaux.title.proceeding2025 IEEE 75th Electronic Components and Technology Conference (ECTC)en_US
bordeaux.teamRELIABILITYen_US
bordeaux.conference.cityDallasen_US
bordeaux.import.sourcecrossref
hal.proceedingsouien_US
hal.conference.end2025-05-30
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exporttrue
workflow.import.sourcecrossref
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2025-05-27&rft.spage=2133-2139&rft.epage=2133-2139&rft.au=MAHAUT,%20Victor&DUBOIS,%20Tristan&GRACIA,%20Alexandrine&MAIA,%20Wilson&rft.genre=unknown


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