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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorBILLY, Philippine
dc.contributor.authorGUITARD, Nicolas
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorZIMMER, Thomas
IDREF: 076632598
dc.contributor.authorGAUTHIER, Alexis
dc.contributor.authorCHEVALIER, Pascal
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorFREGONESE, Sebastien
dc.date.accessioned2025-10-13T08:37:25Z
dc.date.available2025-10-13T08:37:25Z
dc.date.issued2025-09
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/207797
dc.description.abstractEnThis article explores the impact of the substrate network on the high-frequency performance characteristics of silicon/silicon–germanium (Si/SiGe) heterojunction bipolar transistors (HBTs). The influence of the substrate network becomes particularly significant at frequencies above 100 GHz, necessitating advanced measurement and de-embedding techniques. In this study, we employ the advanced 16-term error calibration method to accurately extract the maximum oscillation frequency ( fMAX) up to 500 GHz. This approach allows us to observe second-order effects, such as the impact of substrate network, for the first time. Our findings reveal that the substrate network has significant implications for the optimization of high-frequency Si/SiGe HBTs, especially on fMAX . The study provides insights into substrate-related parasitic effects and proposes strategies to mitigate these effects.
dc.language.isoENen_US
dc.subject.enDe-embedding
dc.subject.enFmax
dc.subject.enSiGe heterojunction bipolar transistor (HBT)
dc.subject.enSubstrate
dc.title.enInvestigating Substrate Network Effects on Si/SiGe HBT Performance Up to 500 GHz
dc.typeArticle de revueen_US
dc.identifier.doi10.1109/ted.2025.3593217en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.journalIEEE Transactions on Electron Devicesen_US
bordeaux.page4721-4727en_US
bordeaux.volume72en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.issue9en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.teamTERAHERTZen_US
bordeaux.peerReviewedouien_US
bordeaux.inpressnonen_US
bordeaux.import.sourcecrossref
hal.identifierhal-05311255
hal.version1
hal.date.transferred2025-10-13T08:37:27Z
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exporttrue
workflow.import.sourcecrossref
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=IEEE%20Transactions%20on%20Electron%20Devices&rft.date=2025-09&rft.volume=72&rft.issue=9&rft.spage=4721-4727&rft.epage=4721-4727&rft.au=BILLY,%20Philippine&GUITARD,%20Nicolas&ZIMMER,%20Thomas&GAUTHIER,%20Alexis&CHEVALIER,%20Pascal&rft.genre=article


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