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Planar Low-Loss Ultra-Wideband Coaxial-Less Balun and 4-Way Combiner for High-Power Applications

dc.rights.licenseopenen_US
dc.contributor.authorBREGEON, Victor
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorGHIOTTO, Anthony
dc.contributor.authorDE OLIVEIRA, Jose
dc.contributor.authorGOUJON, Christophe
dc.contributor.authorMOUGINOT, Guillaume
dc.date.accessioned2025-10-13T08:16:31Z
dc.date.available2025-10-13T08:16:31Z
dc.date.issued2025-06-15
dc.date.conference2025-06-15
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/207794
dc.description.abstractEnThis paper presents a planar high-power low-loss ultra-wideband balun and its application in the design of a 4-way combiner. The balun is based on a ferrite core and printed circuit board (PCB) transmission lines. Its coaxial-less design offers a PFAS-free alternative, enhanced flexibility due to unrestricted characteristic impedances, as well as improved repeatability and cost-efficiency by minimizing assembly steps. The paper details the balun's analysis, simulation, and implementation, supported by experimental validation. Across the 20 to 835 MHz frequency range, the balun achieves a return loss (RL) and insertion loss (IL) better than 22.4 dB and 0.5 dB, respectively, with amplitude and phase imbalances less than 0.7 dB and 10°, respectively. Additionally, the paper demonstrates a 4 -way combiner based on the proposed balun. The combiner achieves measured RL and IL values better than 17.5 dB and 0.5 dB, respectively, within the 20 to 500 MHz frequency range, while successfully handling over 400 W of pulsed power.
dc.language.isoENen_US
dc.subject.enBaluns
dc.subject.enFerrite devices
dc.subject.enPower amplifiers
dc.subject.enPower combiners
dc.subject.enUHF
dc.subject.enVHF
dc.subject.enWideband
dc.title.enPlanar Low-Loss Ultra-Wideband Coaxial-Less Balun and 4-Way Combiner for High-Power Applications
dc.typeCommunication dans un congrèsen_US
dc.identifier.doi10.1109/ims40360.2025.11103903en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.page312-315en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.title2025 IEEE/MTT-S International Microwave Symposium (IMS)en_US
bordeaux.countryusen_US
bordeaux.title.proceeding2025 IEEE/MTT-S International Microwave Symposium - IMS 2025en_US
bordeaux.teamCIRCUIT DESIGN - CSHen_US
bordeaux.conference.citySan Franciscoen_US
bordeaux.import.sourcecrossref
hal.identifierhal-05311195
hal.version1
hal.date.transferred2025-10-13T08:16:33Z
hal.proceedingsouien_US
hal.conference.end2025-06-20
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exporttrue
workflow.import.sourcecrossref
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2025-06-15&rft.spage=312-315&rft.epage=312-315&rft.au=BREGEON,%20Victor&GHIOTTO,%20Anthony&DE%20OLIVEIRA,%20Jose&GOUJON,%20Christophe&MOUGINOT,%20Guillaume&rft.genre=unknown


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