Bias Temperature Instability Characterization and Modeling for 0.18um CMOS Under Extreme Thermal Stress Conditions
| dc.rights.license | open | en_US |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | TRAN, Yen | |
| dc.contributor.author | NOMURA, Toshihiro | |
| dc.contributor.author | CHERCHALI, Mohamed Salim | |
| dc.contributor.author | TASSIN, Claire | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | DEVAL, Yann | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | MANEUX, Cristell
IDREF: 135213584 | |
| dc.date.accessioned | 2024-04-30T08:28:17Z | |
| dc.date.available | 2024-04-30T08:28:17Z | |
| dc.date.issued | 2021-07 | |
| dc.date.conference | 2021-07-19 | |
| dc.identifier.isbn | 978-3-8007-5588-2 | en_US |
| dc.identifier.issn | 2473-2001 | en_US |
| dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/199521 | |
| dc.description.abstract | We investigated the significance of 0.18um CMOS (Complementary Metal-Oxide-Semiconductor) degradation due to bias temperature instability (BTI) under extreme temperature operations (150 degC and 210 degC). The transistors have been applied dedicated DC bias and temperature conditions to investigate the wear-out mechanism in specific severe environment for oilfield applications. The aging tests have been monitored up to 1,000 hours. These results are preliminarily used to develop equations reflecting aging laws to be included in commercial software tool for further investigation at logic circuit level. | |
| dc.language.iso | EN | en_US |
| dc.title.en | Bias Temperature Instability Characterization and Modeling for 0.18um CMOS Under Extreme Thermal Stress Conditions | |
| dc.type | Communication dans un congrès | en_US |
| dc.subject.hal | Sciences de l'ingénieur [physics] | en_US |
| bordeaux.page | 1-4 | en_US |
| bordeaux.hal.laboratories | IMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 | en_US |
| bordeaux.institution | Université de Bordeaux | en_US |
| bordeaux.institution | Bordeaux INP | en_US |
| bordeaux.institution | CNRS | en_US |
| bordeaux.conference.title | SMACD / PRIME 2021; International Conference on SMACD and 16th Conference on PRIME | en_US |
| bordeaux.title.proceeding | SMACD / PRIME 2021; International Conference on SMACD and 16th Conference on PRIME | en_US |
| bordeaux.team | CIRCUIT DESIGN-CAS | en_US |
| bordeaux.team | CIRCUIT DESIGN-M4C | en_US |
| bordeaux.conference.city | Online | en_US |
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| hal.invited | oui | en_US |
| hal.proceedings | oui | en_US |
| hal.conference.organizer | ITG Informationstechnische Gesells. im VDE | en_US |
| hal.conference.end | 2021-07-22 | |
| hal.popular | non | en_US |
| hal.audience | Internationale | en_US |
| hal.export | true | |
| dc.rights.cc | Pas de Licence CC | en_US |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2021-07&rft.spage=1-4&rft.epage=1-4&rft.eissn=2473-2001&rft.issn=2473-2001&rft.au=TRAN,%20Yen&NOMURA,%20Toshihiro&CHERCHALI,%20Mohamed%20Salim&TASSIN,%20Claire&DEVAL,%20Yann&rft.isbn=978-3-8007-5588-2&rft.genre=unknown |
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