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Bias Temperature Instability Characterization and Modeling for 0.18um CMOS Under Extreme Thermal Stress Conditions

dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorTRAN, Yen
dc.contributor.authorNOMURA, Toshihiro
dc.contributor.authorCHERCHALI, Mohamed Salim
dc.contributor.authorTASSIN, Claire
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorDEVAL, Yann
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorMANEUX, Cristell
IDREF: 135213584
dc.date.accessioned2024-04-30T08:28:17Z
dc.date.available2024-04-30T08:28:17Z
dc.date.issued2021-07
dc.date.conference2021-07-19
dc.identifier.isbn978-3-8007-5588-2en_US
dc.identifier.issn2473-2001en_US
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/199521
dc.description.abstractWe investigated the significance of 0.18um CMOS (Complementary Metal-Oxide-Semiconductor) degradation due to bias temperature instability (BTI) under extreme temperature operations (150 degC and 210 degC). The transistors have been applied dedicated DC bias and temperature conditions to investigate the wear-out mechanism in specific severe environment for oilfield applications. The aging tests have been monitored up to 1,000 hours. These results are preliminarily used to develop equations reflecting aging laws to be included in commercial software tool for further investigation at logic circuit level.
dc.language.isoENen_US
dc.title.enBias Temperature Instability Characterization and Modeling for 0.18um CMOS Under Extreme Thermal Stress Conditions
dc.typeCommunication dans un congrèsen_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.page1-4en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.titleSMACD / PRIME 2021; International Conference on SMACD and 16th Conference on PRIMEen_US
bordeaux.title.proceedingSMACD / PRIME 2021; International Conference on SMACD and 16th Conference on PRIMEen_US
bordeaux.teamCIRCUIT DESIGN-CASen_US
bordeaux.teamCIRCUIT DESIGN-M4Cen_US
bordeaux.conference.cityOnlineen_US
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hal.invitedouien_US
hal.proceedingsouien_US
hal.conference.organizerITG Informationstechnische Gesells. im VDEen_US
hal.conference.end2021-07-22
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exporttrue
dc.rights.ccPas de Licence CCen_US
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