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A Vertical Transition between Microstrip Line and Air-Filled SIW at Ka-band

dc.rights.licenseopenen_US
dc.contributor.authorZHANG, Jingwen
dc.contributor.authorDUROC, Yvan
dc.contributor.authorWU, Ke
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorGHIOTTO, Anthony
dc.contributor.authorVOUNG, Tan-Phu
dc.date.accessioned2024-03-05T08:18:14Z
dc.date.available2024-03-05T08:18:14Z
dc.date.issued2022-09
dc.date.conference2022-09-27
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/188586
dc.description.abstractEnA low-loss vertical transition between microstrip line and air-filled substrate integrated waveguide (AFSIW) at Ka-band is proposed. The objective is to be able to connect active components based on microstrip technology with passive components based on AFSIW technology. The coupling between the quasi-TEM mode of the microstrip line and the TE10 mode of the AFSIW guide is carried out by a slot and a copper line placed on one layer of the substrate. To obtain reliable measurements, a back-to-back transition has been designed and fabricated. The measured results obtained show that over a frequency range of 27.5 GHz to 29.8 GHz the proposed transition has a reflection coefficient of between −10 dB and −15 dB and insertion losses between 0.78 dB and 1.45 dB.
dc.language.isoENen_US
dc.subjectWaveguide transitions
dc.subjectTransmission lines
dc.subjectThree-dimensional displays
dc.subjectWaveguide components
dc.subjectInsertion loss
dc.subjectLoss measurement
dc.subjectReflection coefficient
dc.subjectAir-filled substrate integrated waveguide (AFSIW)
dc.subjectMicrostrip
dc.subjectTransition
dc.subjectKa-band
dc.title.enA Vertical Transition between Microstrip Line and Air-Filled SIW at Ka-band
dc.typeCommunication dans un congrèsen_US
dc.identifier.doi10.23919/EuMC54642.2022.9924415en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.page484-487en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.title2022 52nd European Microwave Conference (EuMC)en_US
bordeaux.countryiten_US
bordeaux.title.proceeding2022 52nd European Microwave Conference (EuMC)en_US
bordeaux.teamCIRCUIT DESIGN-CSHen_US
bordeaux.conference.cityMilanen_US
hal.invitedouien_US
hal.proceedingsouien_US
hal.conference.end2022-09-29
hal.popularnonen_US
hal.audienceInternationaleen_US
hal.exportfalse
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2022-09&rft.spage=484-487&rft.epage=484-487&rft.au=ZHANG,%20Jingwen&DUROC,%20Yvan&WU,%20Ke&GHIOTTO,%20Anthony&VOUNG,%20Tan-Phu&rft.genre=unknown


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