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hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierSchneider Electric [ SE]
dc.contributor.authorBIDENT, Antoine
hal.structure.identifierSchneider Electric [ SE]
dc.contributor.authorDELANGE, Florence
hal.structure.identifierPlateforme Aquitaine de Caractérisation des Matériaux [PLACAMAT]
dc.contributor.authorLABRUGÈRE-SARROSTE, Christine
hal.structure.identifierLaboratoire Interfaces et Systèmes Electrochimiques [LISE]
dc.contributor.authorDEBIEMME-CHOUVY, Catherine
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorLU, Yongfeng
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorSILVAIN, Jean‐françois
dc.date.issued2024
dc.identifier.issn0021-9983
dc.description.abstractEnThe consistent rise in current density within electrical wires leads to progressively more substantial heat losses attributed to the Joule effect. Consequently, mitigating the electrical resistivity of copper wires becomes imperative. To attain this objective, the development of a composite material that incorporates a more conductive reinforcement, like graphene, holds great promise. The conception of a copper/graphene composite using a powder metallurgy-based approach is presented. An optimum graphene quantity of 0.06 vol.% was obtained by calculation in order to limit the phenomenon of overlapping layers. This synthesis technique enables the dispersion of graphene and the meticulous control of the interface through the growth of CuO(Cu) nanoparticles that are tightly bonded to the reinforcement. The increase in the hardness of the various materials with separation of the graphene sheets by ultrasonic treatment (55.3 to 67.6 HV) was obtained. It is an indicator of the correct distribution of the reinforcement. The influence on the electrical properties of dendritic copper (ρe = 2.30 µV.cm) remains limited, resulting in a modest reduction in electrical resistance of around 1.4%. Nevertheless, for flake copper (2.71 µV.cm) and brass (7.66 µV.cm), we achieved a more substantial reduction of 2.7% and 10%, respectively. With the improvement of graphene quality, there exists a greater potential for further enhancing the electrical properties.
dc.language.isoen
dc.publisherSAGE Publications
dc.subject.enGraphene
dc.subject.enSurface treatment
dc.subject.enHardness
dc.subject.enElectrical conductivity
dc.subject.enComposites
dc.subject.enCopper
dc.subject.enPowder metallurgy
dc.title.enFabrication and characterization of copper and copper alloys reinforced with graphene
dc.typeArticle de revue
dc.identifier.doi10.1177/00219983231215210
dc.subject.halChimie/Matériaux
dc.subject.halChimie
bordeaux.journalJournal of Composite Materials
bordeaux.page109-117
bordeaux.volume58
bordeaux.issue1
bordeaux.peerReviewedoui
hal.identifierhal-04314387
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-04314387v1
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