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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorCAPELLI-MOUVAND, Thomas
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorDELTIMPLE, Nathalie
IDREF: 102460280
dc.contributor.authorCATHELIN, Philippe
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorGHIOTTO, Anthony
dc.date.accessioned2023-05-02T07:15:11Z
dc.date.available2023-05-02T07:15:11Z
dc.date.issued2023-04-18
dc.identifier.issn1558-3791en_US
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/173225
dc.description.abstractThis paper proposes an innovative concept of spatial third-order intermodulation products (IMD3) filtering in millimeter-wave 5G phased arrays. This technique aims to relax the linearity constraints on the power amplifiers (PA) and thus power consumption. Implementation of independent control of the phase of IMD3 is proposed by using the nonlinear output capacitance of metal-oxide semi-conductors (MOS) amplifiers under phase-controlled second harmonic injection. The implemented control uses beamforming properties to perform spatial filtering of IMD3 product. A second harmonic injection on a power amplifier is proposed in STMicroelectronics CMOS065SOIMMW technology at 28 GHz. It shows phase control of IMD3 with a range of 35 degrees, allowing relaxation up to 17 dB on the linearity of large phased array power amplifiers.
dc.language.isoENen_US
dc.subjectPhased arrays
dc.subjectAntenna arrays
dc.subjectHarmonic analysis
dc.subjectPower harmonic filters
dc.subjectPower amplifiers
dc.subjectTransistors
dc.subjectArray signal processing
dc.subject5G
dc.subjectBeamforming
dc.subjectIMD3
dc.subjectLinearity
dc.subjectMillimeterwaves
dc.subjectPhased array
dc.subjectPower amplifier
dc.title.enThird Order Intermodulations Phase Shifting in Power Amplifiers for Spatial filtering in Multi-beam 5G mmW Phased Array
dc.typeArticle de revueen_US
dc.identifier.doi10.1109/TCSII.2023.3268102
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.journalIEEE Transactions on Circuits and Systems II: Express Briefsen_US
bordeaux.page1-1en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.hal.laboratoriesSTMicroelectronicsen_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.teamCONCEPTION-CSHen_US
bordeaux.peerReviewedouien_US
bordeaux.inpressnonen_US
hal.identifierhal-04086339
hal.version1
hal.date.transferred2023-05-02T07:15:13Z
hal.exporttrue
workflow.import.sourcedissemin
dc.rights.ccPas de Licence CCen_US
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