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TESTING OF THE QUALITY OF SOLDER JOINTS THROUGH THE ANALYSIS OF THEIR THERMAL-BEHAVIOR WITH AN INTERFEROMETRIC LASER PROBE

hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorCLAEYS, W.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorQUINTARD, V.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorDILHAIRE, S.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorLEWIS, D.
hal.structure.identifierLaboratoire d'études de l'intégration des composants et systèmes électroniques [IXL]
dc.contributor.authorDANTO, Y.
dc.date.issued1994
dc.identifier.issn0748-8017
dc.description.abstractEnno abstract
dc.language.isoen
dc.publisherWiley
dc.title.enTESTING OF THE QUALITY OF SOLDER JOINTS THROUGH THE ANALYSIS OF THEIR THERMAL-BEHAVIOR WITH AN INTERFEROMETRIC LASER PROBE
dc.typeArticle de revue
dc.subject.halPhysique [physics]
bordeaux.journalQuality and Reliability Engineering International
bordeaux.page237-242
bordeaux.volume10
bordeaux.issue3
bordeaux.peerReviewedoui
hal.identifierhal-01549896
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01549896v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Quality%20and%20Reliability%20Engineering%20International&rft.date=1994&rft.volume=10&rft.issue=3&rft.spage=237-242&rft.epage=237-242&rft.eissn=0748-8017&rft.issn=0748-8017&rft.au=CLAEYS,%20W.&QUINTARD,%20V.&DILHAIRE,%20S.&LEWIS,%20D.&DANTO,%20Y.&rft.genre=article


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