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hal.structure.identifierDepartment of Electronic Engineering
dc.contributor.authorALTET, J.
hal.structure.identifierDepartment of Electronic Engineering
dc.contributor.authorRUBIO, A.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorCLAEYS, W.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorDILHAIRE, S.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorSCHAUB, E.
hal.structure.identifierDepartment of Computer Science and Engineering [Akita]
dc.contributor.authorTAMAMOTO, H.
dc.date.issued1999-02
dc.identifier.issn0923-8174
dc.description.abstractEnTesting techniques based on the functional behaviour, the propagation delay and the levels of quiescent current have been used with great success for the last two decade technologies. However, the efficiency of such techniques is dubious for future technologies, characterised by huge mixed-mode complex circuits and very low supply voltage levels. In this paper the feasibility of using internal thermal sensors to detect heat sources provoked by structural defects are considered and evaluated.
dc.language.isoen
dc.publisherSpringer Verlag
dc.title.enDifferential thermal testing: An approach to its feasibility
dc.typeArticle de revue
dc.identifier.doi10.1023/a:1008397205559
dc.subject.halPhysique [physics]
bordeaux.journalJournal of Electronic Testing: : Theory and Applications
bordeaux.page57-66
bordeaux.volume14
bordeaux.issue1-2
bordeaux.peerReviewedoui
hal.identifierhal-01550415
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01550415v1
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