Optical method for the measurement of the thermomechanical behaviour of electronic devices
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | DILHAIRE, S. | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | JOREZ, S. | |
| hal.structure.identifier | Laboratoire d'Optique Appliquée [FYAM] | |
| dc.contributor.author | CORNET, A. | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | SCHAUB, Emmanuel | |
| hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
| dc.contributor.author | CLAEYS, W. | |
| dc.date.issued | 1999-06 | |
| dc.identifier.issn | 0026-2714 | |
| dc.description.abstractEn | We present in this paper a laser probing method for the study of the surface deformation and thermomechanical behaviour of electronic components. The method has been applied to running power devices and creep analysis of solder joints in after-fabrication processes. The set-up allows following the whole surface deformation as a function of time even in the long-term range. The method is based upon electronic speckle pattern interferometry (ESPI) and allows measuring surface normal deformation with a 10nm resolution. | |
| dc.language.iso | en | |
| dc.publisher | Elsevier | |
| dc.title.en | Optical method for the measurement of the thermomechanical behaviour of electronic devices | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1016/S0026-2714(99)00134-1 | |
| dc.subject.hal | Physique [physics] | |
| bordeaux.journal | Microelectronics Reliability | |
| bordeaux.page | 981-985 | |
| bordeaux.volume | 39 | |
| bordeaux.issue | 6-7 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-01550431 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Internationale | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-01550431v1 | |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Microelectronics%20Reliability&rft.date=1999-06&rft.volume=39&rft.issue=6-7&rft.spage=981-985&rft.epage=981-985&rft.eissn=0026-2714&rft.issn=0026-2714&rft.au=DILHAIRE,%20S.&JOREZ,%20S.&CORNET,%20A.&SCHAUB,%20Emmanuel&CLAEYS,%20W.&rft.genre=article |
Fichier(s) constituant ce document
| Fichiers | Taille | Format | Vue |
|---|---|---|---|
|
Il n'y a pas de fichiers associés à ce document. |
|||