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Four different approaches for the measurement of IC surface temperature: application to thermal testing

hal.structure.identifierDepartment of Electronic Engineering
dc.contributor.authorALTET, J.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorDILHAIRE, S.
hal.structure.identifierLaboratoire d'études thermiques [LET]
dc.contributor.authorVOLZ, S.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorRAMPNOUX, Jean-Michel
hal.structure.identifierDepartment of Electronic Engineering
dc.contributor.authorRUBIO, A.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorGRAUBY, Stéphane
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorLOPEZ, L. D. P.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorCLAEYS, W.
hal.structure.identifierLaboratoire d'études thermiques [LET]
dc.contributor.authorSAULNIER, J. B.
dc.date.issued2002-09-01
dc.identifier.issn0026-2692
dc.description.abstractEnSilicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper, four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the detection and localisation of hot spots in an IC.
dc.language.isoen
dc.publisherElsevier
dc.title.enFour different approaches for the measurement of IC surface temperature: application to thermal testing
dc.typeArticle de revue
dc.identifier.doi10.1016/S0026-2692(02)00051-4
dc.subject.halPhysique [physics]
bordeaux.journalMicroelectronics Journal
bordeaux.page689-696
bordeaux.volume33
bordeaux.issue9
bordeaux.peerReviewedoui
hal.identifierhal-01550815
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01550815v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Microelectronics%20Journal&rft.date=2002-09-01&rft.volume=33&rft.issue=9&rft.spage=689-696&rft.epage=689-696&rft.eissn=0026-2692&rft.issn=0026-2692&rft.au=ALTET,%20J.&DILHAIRE,%20S.&VOLZ,%20S.&RAMPNOUX,%20Jean-Michel&RUBIO,%20A.&rft.genre=article


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