Effect of Nanostructuration on the Thermal Conductivity of Thermoelectric Materials
hal.structure.identifier | Laboratoire Ondes et Matière d'Aquitaine [LOMA] | |
dc.contributor.author | GRAUBY, Stéphane | |
hal.structure.identifier | Institut National des Sciences Appliquées de Lyon [INSA Lyon] | |
dc.contributor.author | PUYOO, E. | |
hal.structure.identifier | Instituto de Microelectronica de Madrid [IMM] | |
dc.contributor.author | ROJO, M. M. | |
hal.structure.identifier | Instituto de Microelectronica de Madrid [IMM] | |
dc.contributor.author | MARTIN-GONZALEZ, M. | |
hal.structure.identifier | Laboratoire Ondes et Matière d'Aquitaine [LOMA] | |
dc.contributor.author | CLAEYS, W. | |
hal.structure.identifier | Laboratoire Ondes et Matière d'Aquitaine [LOMA] | |
dc.contributor.author | DILHAIRE, S. | |
dc.date.issued | 2013 | |
dc.date.conference | 2013-09-25 | |
dc.description.abstractEn | We have investigated various kinds of nanowires (Si, Bi2Te3, SiGe) in order to evaluate the influence of the nanostructuration on their thermal conductivity. The method used is a 3ω-SThM (Scanning Thermal Microscopy) technique which enables to simultaneously measure the topography and the thermal conductivity on an assembly of NWs. We detail the procedure from the measurement itself to the nanowire thermal conductivity estimation. We show that the nanostructuration leads to a thermal conductivity reduction for the 3 materials we have studied and that Si and SiGe nanowire samples seem more promising than Bi2Te3 NWs in terms of thermoelectric applications. | |
dc.language.iso | en | |
dc.source.title | Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on | |
dc.subject.en | Thermal conductivity | |
dc.subject.en | Conductivity | |
dc.subject.en | Silicon | |
dc.subject.en | Thermal resistance | |
dc.subject.en | Nanowires | |
dc.subject.en | Conductivity measurement | |
dc.title.en | Effect of Nanostructuration on the Thermal Conductivity of Thermoelectric Materials | |
dc.type | Communication dans un congrès | |
dc.identifier.doi | 10.1109/THERMINIC.2013.6675191 | |
dc.subject.hal | Physique [physics] | |
bordeaux.page | 73-78 | |
bordeaux.country | DE | |
bordeaux.title.proceeding | Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on | |
bordeaux.conference.city | Berlin | |
bordeaux.peerReviewed | non | |
hal.identifier | hal-01555675 | |
hal.version | 1 | |
hal.invited | non | |
hal.proceedings | oui | |
hal.conference.end | 2013-09-27 | |
hal.popular | non | |
hal.audience | Internationale | |
hal.origin.link | https://hal.archives-ouvertes.fr//hal-01555675v1 | |
bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.btitle=Thermal%20Investigations%20of%20ICs%20and%20Systems%20(THERMINIC),%202013%2019th%20International%20Workshop%20on&rft.date=2013&rft.spage=73-78&rft.epage=73-78&rft.au=GRAUBY,%20St%C3%A9phane&PUYOO,%20E.&ROJO,%20M.%20M.&MARTIN-GONZALEZ,%20M.&CLAEYS,%20W.&rft.genre=unknown |
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