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Temperature measurement of sub-micrometric ICs by scanning thermal microscopy

hal.structure.identifierGénome, Population, Interactions
hal.structure.identifierMicro et nanothermique [MN]
dc.contributor.authorGOMÈS, Séverine
hal.structure.identifierMicro et nanothermique [MN]
hal.structure.identifierLaboratoire d'Énergétique Moléculaire et Macroscopique, Combustion [EM2C]
dc.contributor.authorCHAPUIS, Pierre-Olivier
hal.structure.identifierGénome, Population, Interactions
hal.structure.identifierMicro et nanothermique [MN]
dc.contributor.authorNEPVEU, François
hal.structure.identifierMicro et nanothermique [MN]
hal.structure.identifierLaboratoire d'énergétique et d'optique - Unité de thermique et d'analyse physique [LEO - UTAP]
dc.contributor.authorTRANNOY, Nathalie
hal.structure.identifierMicro et nanothermique [MN]
hal.structure.identifierLaboratoire d'Énergétique Moléculaire et Macroscopique, Combustion [EM2C]
dc.contributor.authorVOLZ, Sebastian
hal.structure.identifierMicro et nanothermique [MN]
hal.structure.identifierTechniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés [TIMA]
dc.contributor.authorCHARLOT, Benoît
hal.structure.identifierMicro et nanothermique [MN]
hal.structure.identifierLaboratoire Photons Et Matière
dc.contributor.authorTESSIER, Gilles
hal.structure.identifierMicro et nanothermique [MN]
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorDILHAIRE, Stefan
hal.structure.identifierMicro et nanothermique [MN]
hal.structure.identifierFranche-Comté Électronique Mécanique, Thermique et Optique - Sciences et Technologies (UMR 6174) [FEMTO-ST]
dc.contributor.authorCRETIN, Bernard
hal.structure.identifierMicro et nanothermique [MN]
hal.structure.identifierFranche-Comté Électronique Mécanique, Thermique et Optique - Sciences et Technologies (UMR 6174) [FEMTO-ST]
dc.contributor.authorVAIRAC, Pascal
dc.date.issued2007-09
dc.identifier.issn1521-3331
dc.description.abstractEnSurface temperature measurements were performed with a Scanning Thermal Microscope mounted with a thermoresistive wire probe of micrometrSurface temperature measurements were performed with a Scanning Thermal Microscope mounted with a thermoresistive wire probe of micrometric size. A CMOS device was designed with arrays of resistive lines 0.35µm in width. The array periods are 0.8 µm and 10µm to study the spatial resolution of the SThM. Integrated Circuits with passivation layers of micrometric and nanometric thicknesses were tested. To enhance signal-to-noise ratio, the resistive lines were heated with an AC current. The passivation layer of nanometric thickness allows us to distinguish the lines when the array period is 10μm. The results raise the difficulties of the SThM measurement due to the design and the topography of ICs on one hand and the size of the thermal probe on the other hand.ic size. A CMOS device was designed with arrays of resistive lines 0.35µm in width. The array periods are 0.8 µm and 10µm to study the spatial resolution of the SThM. Integrated Circuits with passivation layers of micrometric and nanometric thicknesses were tested. To enhance signal-to-noise ratio, the resistive lines were heated with an AC current. The passivation layer of nanometric thickness allows us to distinguish the lines when the array period is 10μm. The results raise the difficulties of the SThM measurement due to the design and the topography of ICs on one hand and the size of the thermal probe on the other hand.
dc.language.isoen
dc.publisherInstitute of Electrical and Electronics Engineers
dc.title.enTemperature measurement of sub-micrometric ICs by scanning thermal microscopy
dc.typeArticle de revue
dc.identifier.doi10.1109/TCAPT.2007.901748
dc.subject.halPhysique [physics]/Mécanique [physics]/Thermique [physics.class-ph]
dc.subject.halSciences de l'ingénieur [physics]/Mécanique [physics.med-ph]/Thermique [physics.class-ph]
dc.subject.halSciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique
dc.identifier.arxiv0711.4530
bordeaux.journalIEEE Transactions on Components and Packaging Technologies
bordeaux.page424-431
bordeaux.volume30
bordeaux.issue3
bordeaux.peerReviewedoui
hal.identifierhal-00192611
hal.version1
hal.popularnon
hal.audienceNon spécifiée
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00192611v1
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