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hal.structure.identifierElectronic Engineering Department
dc.contributor.authorALTET, J.
hal.structure.identifierElectronic Engineering Department
dc.contributor.authorALDRETE-VIDRIO, E.
hal.structure.identifierElectronic Engineering Department
dc.contributor.authorMATEO, D.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorSALHI, A.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorGRAUBY, Stéphane
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorCLAEYS, W.
hal.structure.identifierCentre de physique moléculaire optique et hertzienne [CPMOH]
dc.contributor.authorDILHAIRE, Stefan
hal.structure.identifierCentre Nacional de Microelectrònica [CNM]
dc.contributor.authorPERPINA, Xavier
hal.structure.identifierCentre Nacional de Microelectrònica [CNM]
dc.contributor.authorJORDÀ, Xavier
dc.date.created2008-10-29
dc.date.issued2009-02-02
dc.identifier.issn0034-6748
dc.description.abstractEnHeterodyne strategies can be used to characterize thermal coupling in integrated circuits when the electrical bandwidth of the dissipating circuit is beyond the bandwidth of the thermal coupling mechanism. From the characterization of the thermal coupling, two possible applications are described: extraction of characteristics of the dissipating circuit (the determination of the center frequency of a low-noise amplifie) and the extraction of the thermal coupling transfer function.
dc.language.isoen
dc.publisherAmerican Institute of Physics
dc.title.enHeterodyne lock-in thermal coupling measurements in integrated circuits: Applications to test and characterization
dc.typeArticle de revue
dc.identifier.doi10.1063/1.3073963
dc.subject.halSciences de l'ingénieur [physics]/Electronique
bordeaux.journalReview of Scientific Instruments
bordeaux.page026101 (1-3)
bordeaux.volume80
bordeaux.issue2
bordeaux.peerReviewedoui
hal.identifierhal-00505869
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00505869v1
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