Afficher la notice abrégée

Improved adhesion of polycrystalline diamond films on copper/carbon composite surfaces due to in situ formation of mechanical gripping sites

hal.structure.identifierDepartment of Electrical Engineering
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorAZINA, Clio
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorWANG, Mengmeng
hal.structure.identifierDepartment of Electrical Engineering
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorFEUILLET, Emilien
hal.structure.identifierDepartment of Electrical Engineering
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorCONSTANTIN, Loic
hal.structure.identifierDGA/Mission pour la Recherche et l'Innovation Scientifique [DGA/MRIS]
dc.contributor.authorMORTAIGNE, Bruno
hal.structure.identifierScience des Procédés Céramiques et de Traitements de Surface [SPCTS]
dc.contributor.authorGEFFROY, Pierre-Marie
hal.structure.identifierDepartment of Electrical Engineering
dc.contributor.authorLU, Yongfeng
hal.structure.identifierDepartment of Electrical Engineering
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
dc.date.issued2017
dc.identifier.issn0257-8972
dc.description.abstractEnDiamond coatings are investigated for thermal management, wear protection and corrosion resistance in harsh environments. In power electronic industries, copper (Cu), which shows high thermal conductivity, is considered as a promising substrate for diamond based heat-spread materials. However, the coefficient of thermal expansion (CTE) mismatch between diamond and Cu induces thermo-mechanical stresses that affect the integrity of the diamond-Cu assembly. In fact, diamond films deposited on Cu substrates tend to peel-off upon cooling due to the compressive stresses present at the diamond-Cu interface. This investigation is focused on the growth of polycrystalline diamond thin films onto Cu/CF (CF) composite materials, using combustion flame chemical vapor deposition (CVD). It has been found that increased CF content in the Cu/CF materials leads to a reduced CTE improving, hence, the adhesion between the diamond film and the Cu/CF substrate and reduces Cu/CF-diamond interfacial residual thermal stresses. At a CF content of 40% in volume, the residual thermal stress of the diamond film deposited on the Cu/CF composite is lower than that on bare Cu and adapted with CVD diamond growth. Naturally engineered composite surfaces have enhanced the adhesion of the diamond film on the composite substrate via mechanical interlocking.
dc.language.isoen
dc.publisherElsevier
dc.subject.enMMC
dc.subject.endiamond deposition
dc.subject.encombustion CVD
dc.subject.enmechanical gripping
dc.subject.ensurface engineering
dc.title.enImproved adhesion of polycrystalline diamond films on copper/carbon composite surfaces due to in situ formation of mechanical gripping sites
dc.typeArticle de revue
dc.identifier.doi10.1016/j.surfcoat.2017.04.037
dc.subject.halChimie/Matériaux
bordeaux.journalSurface and Coatings Technology
bordeaux.page1-7
bordeaux.volume321
bordeaux.peerReviewedoui
hal.identifierhal-01531340
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-01531340v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Surface%20and%20Coatings%20Technology&rft.date=2017&rft.volume=321&rft.spage=1-7&rft.epage=1-7&rft.eissn=0257-8972&rft.issn=0257-8972&rft.au=AZINA,%20Clio&WANG,%20Mengmeng&FEUILLET,%20Emilien&CONSTANTIN,%20Loic&MORTAIGNE,%20Bruno&rft.genre=article


Fichier(s) constituant ce document

FichiersTailleFormatVue

Il n'y a pas de fichiers associés à ce document.

Ce document figure dans la(les) collection(s) suivante(s)

Afficher la notice abrégée