Thermal expansion coefficient and thermal fatigue of discontinuous carbon fiber-reinforced copper and aluminum matrix composites without interfacial chemical bond
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | LALET, Grégory | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | KURITA, Hiroki | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | HEINTZ, Jean-Marc | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | LACOMBE, Guillaume | |
| hal.structure.identifier | Department of Materials Processing Engineering | |
| dc.contributor.author | KAWASAKI, Akira | |
| hal.structure.identifier | Institut de Chimie de la Matière Condensée de Bordeaux [ICMCB] | |
| dc.contributor.author | SILVAIN, Jean-François | |
| dc.date.issued | 2014 | |
| dc.identifier.issn | 0022-2461 | |
| dc.description.abstractEn | Fully dense carbon fiber-reinforced copper and aluminum matrix (Cu-CF and Al-CF) composites were fabricated by hot press without the need for an interfacial chemical compound. With 30 vol% carbon fiber, the thermal expansion coefficients (TECs) of pure Cu and Al were decreased to 13.5 × 10−6 and 15.5 × 10−6/K, respectively. These improved TECs of Cu-CF and Al-CF composites were maintained after 16 thermal cycles; moreover, the TEC of the 30 vol% Cu-CF composite was stable after 2500 thermal cycles between −40 and 150 °C. The thermal strain caused by the TEC mismatch between the matrix and the carbon fiber enables mechanical enhancement at the matrix/carbon fiber interface and allows conservation of the improved TECs of Cu-CF and Al-CF composites after thermal cycles. | |
| dc.language.iso | en | |
| dc.publisher | Springer Verlag | |
| dc.title.en | Thermal expansion coefficient and thermal fatigue of discontinuous carbon fiber-reinforced copper and aluminum matrix composites without interfacial chemical bond | |
| dc.type | Article de revue | |
| dc.identifier.doi | 10.1007/s10853-013-7717-7 | |
| dc.subject.hal | Chimie/Matériaux | |
| bordeaux.journal | Journal of Materials Science | |
| bordeaux.page | 397-402 | |
| bordeaux.volume | 49 | |
| bordeaux.issue | 1 | |
| bordeaux.peerReviewed | oui | |
| hal.identifier | hal-00949254 | |
| hal.version | 1 | |
| hal.popular | non | |
| hal.audience | Internationale | |
| hal.origin.link | https://hal.archives-ouvertes.fr//hal-00949254v1 | |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Journal%20of%20Materials%20Science&rft.date=2014&rft.volume=49&rft.issue=1&rft.spage=397-402&rft.epage=397-402&rft.eissn=0022-2461&rft.issn=0022-2461&rft.au=LALET,%20Gr%C3%A9gory&KURITA,%20Hiroki&HEINTZ,%20Jean-Marc&LACOMBE,%20Guillaume&KAWASAKI,%20Akira&rft.genre=article |
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