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hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorBRILLON, Alexandre
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorHEINTZ, Jean-Marc
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorCONSTANTIN, Loïc
hal.structure.identifierLaboratoire Interfaces et Systèmes Electrochimiques [LISE]
dc.contributor.authorPILLIER, Françoise
hal.structure.identifierUniversity of Nebraska–Lincoln
dc.contributor.authorLU, Yongfeng
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierUniversity of Nebraska–Lincoln
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierLaboratoire Interfaces et Systèmes Electrochimiques [LISE]
dc.contributor.authorDEBIEMME-CHOUVY, Catherine
dc.date.issued2022
dc.identifier.issn2452-2139
dc.description.abstractEnFor thermal management applications, copper (Cu) metal matrixes reinforced by carbon are undoubtedly one of the most promising composites for heat spreaders In the frame of this work, hard Cu matrix composites having anisotropic thermal conductivity were fabricated by using Cu flakes coated with carbonized polydopamine. The flakes were coated by simply immersing them into a dopamine aqueous solution, then they were submitted to a thermal treatment under dihydrogen. This easy synthesis method results in a ≈10 nm thick N-doped graphene-like film surrounding the Cu flakes. The subsequently densified composites that contains about 0.23 wt % of C show an increase of hardness up 44% and 172% as compared to pure Cu in the parallel and perpendicular sintering direction, respectively. In addition an anisotropic thermal conductivity is obtained with an anisotropy ratio of 2.75.
dc.language.isoen
dc.publisherElsevier
dc.subject.enMetal matrix composite
dc.subject.enPolydopamine
dc.subject.enCopper matrix
dc.subject.enThermal conductivity
dc.subject.enHardness
dc.title.enAnisotropic thermal conductivity and enhanced hardness of copper matrix composite reinforced with carbonized polydopamine
dc.typeArticle de revue
dc.identifier.doi10.1016/j.coco.2022.101210
dc.subject.halSciences de l'ingénieur [physics]/Matériaux
bordeaux.journalComposites Communications
bordeaux.page101210 (5 p.)
bordeaux.volume33
bordeaux.peerReviewedoui
hal.identifierhal-03700783
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-03700783v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Composites%20Communications&rft.date=2022&rft.volume=33&rft.spage=101210%20(5%20p.)&rft.epage=101210%20(5%20p.)&rft.eissn=2452-2139&rft.issn=2452-2139&rft.au=BRILLON,%20Alexandre&HEINTZ,%20Jean-Marc&CONSTANTIN,%20Lo%C3%AFc&PILLIER,%20Fran%C3%A7oise&LU,%20Yongfeng&rft.genre=article


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