Mostrar el registro sencillo del ítem

Novel processing and characterization of Cu/CNF nanocomposite for high thermal conductivity applications

hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorVINCENT, Cécile
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorHEINTZ, Jean-Marc
hal.structure.identifierDepartment of Engineering Mechanics
dc.contributor.authorCHANDRA, Namas
dc.date.issued2009
dc.identifier.issn0266-3538
dc.description.abstractEnEnhancing the thermal conductivity and reducing the thermal expansion for electronic packaging applications can be achieved by compositing carbon nanofibers in copper-matrices. Though achieving these optimal thermal properties is theoretically possible, such composites are currently not available due to many unresolved practical problems. Conventional compositing processes are incapable of obtaining the desired fiber distribution while controlling the fiber–matrix interfaces for effective heat and load transfers. In this paper, three different powder metallurgy based processes are presented; two based on conventional techniques and the third a relatively new method. The first method is basically the conventional powder metallurgy process. The second and the third methods are also powder metallurgy processes with different ways of modifying the surface of the fibers using either electroless coating or the novel salt decomposition method. It is shown that the salt decomposition method is capable of achieving the desired high thermal conductivity values while the thermal expansion values remain the same in all the three processes.
dc.language.isoen
dc.publisherElsevier
dc.subject.enThermal properties
dc.subject.enNano composites
dc.subject.enPowder processing
dc.subject.enCarbon fibres
dc.title.enNovel processing and characterization of Cu/CNF nanocomposite for high thermal conductivity applications
dc.typeArticle de revue
dc.identifier.doi10.1016/j.compscitech.2009.06.023
dc.subject.halChimie/Matériaux
bordeaux.journalComposites Science and Technology
bordeaux.page2474-2484
bordeaux.volume69
bordeaux.issue14
bordeaux.peerReviewedoui
hal.identifierhal-00438188
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00438188v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Composites%20Science%20and%20Technology&rft.date=2009&rft.volume=69&rft.issue=14&rft.spage=2474-2484&rft.epage=2474-2484&rft.eissn=0266-3538&rft.issn=0266-3538&rft.au=SILVAIN,%20Jean-Fran%C3%A7ois&VINCENT,%20C%C3%A9cile&HEINTZ,%20Jean-Marc&CHANDRA,%20Namas&rft.genre=article


Archivos en el ítem

ArchivosTamañoFormatoVer

No hay archivos asociados a este ítem.

Este ítem aparece en la(s) siguiente(s) colección(ones)

Mostrar el registro sencillo del ítem