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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorPIOTROWICZ, C.
dc.contributor.authorMOHAMAD, B.
dc.contributor.authorRRUSTEMI, B.
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorMALBERT, N.
dc.contributor.authorJAUD, M. A.
dc.contributor.authorVANDENDAELE, W.
dc.contributor.authorCHARLES, M.
dc.contributor.authorGWOZIECKI, R.
dc.date.accessioned2022-07-13T13:24:12Z
dc.date.available2022-07-13T13:24:12Z
dc.date.issued2022-08
dc.identifier.issn0038-1101en_US
dc.identifier.urioai:crossref.org:10.1016/j.sse.2022.108322
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/140485
dc.description.abstractEnIn this paper, several epitaxial variations influencing the two-dimensional electron gas (2DEG) in AlGaN/AlN/GaN heterostructures are investigated. The effects of an n-doped AlGaN barrier and of the AlN spacer thickness are studied by examining the sheet electron density (ns) and the mobility (µs) of the 2DEG using ID(VG) and C(VG) measurements, and 1D Schrödinger-Poisson (1DSP) simulations. Specifically, the correlations between the resistance, µs, ns and the polarization interface charges (σ) are studied. Besides the well-reported benefits of the AlN spacer on ns, we show that a thicker AlN spacer leads to larger ns due to the enhancement of the AlN polarization. In addition, we prove experimentally that an n-doped AlGaN barrier does not significantly improve the 2DEG density but leads to the formation of a second channel in the AlGaN barrier for negative gate voltage (VG ≤ 0 V), driving the overall improvement of the resistance.
dc.language.isoENen_US
dc.sourcecrossref
dc.subject.enAlGaN/AlN/GaN heterostructure
dc.subject.en2DEG
dc.subject.enAlN spacer
dc.subject.enn-Doped AlGaN
dc.subject.enSchrödinger-Poisson simulations
dc.subject.enMeasurements
dc.title.enA comprehensive analysis of AlN spacer and AlGaN n-doping effects on the 2DEG resistance in AlGaN/AlN/GaN heterostructures
dc.typeArticle de revueen_US
dc.identifier.doi10.1016/j.sse.2022.108322en_US
dc.subject.halSciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectroniqueen_US
bordeaux.journalSolid-State Electronicsen_US
bordeaux.page108322en_US
bordeaux.volume194en_US
bordeaux.hal.laboratoriesLaboratoire d’Intégration du Matériau au Système (IMS) - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.peerReviewedouien_US
bordeaux.inpressnonen_US
bordeaux.import.sourcedissemin
hal.identifierhal-03722735
hal.version1
hal.date.transferred2022-07-13T13:24:15Z
hal.exporttrue
workflow.import.sourcedissemin
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Solid-State%20Electronics&rft.date=2022-08&rft.volume=194&rft.spage=108322&rft.epage=108322&rft.eissn=0038-1101&rft.issn=0038-1101&rft.au=PIOTROWICZ,%20C.&MOHAMAD,%20B.&RRUSTEMI,%20B.&MALBERT,%20N.&JAUD,%20M.%20A.&rft.genre=article


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