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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorBERTHIER, Alexandre
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorGHIOTTO, Anthony
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorKERHERVE, Eric
dc.contributor.authorVOGT, Lionel
dc.date.accessioned2022-07-05T13:32:22Z
dc.date.available2022-07-05T13:32:22Z
dc.date.issued2022
dc.date.conference2022-01-16
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/140370
dc.description.abstractEnThis paper presents a 60 GHz 4th order resonant cavities Substrate Integrated Waveguide (SIW) bandpass filter with measured average insertion loss of 1.7 dB and a low in-band ripple of 0.76 dB using a low cost 2 layers PCB process. Robustness to manufacturing process variations is verified on more than 20 measured samples. The filter impact is evaluated in a wireless link composed of commercial 60 GHz transceiver chips from ST Microelectronics fabricated in 65nm bulk CMOS technology. The filter causes a wireless jitter degradation of 22 ps and only 7 ps in conducted measurements for an OOK modulation at 5 Gbps. This planar filter present one of the lowest loss and in-band ripple in comparison to prior art, on top of satisfying spectral constraints and modulated signal quality specifications in the 57-64 GHz band.
dc.language.isoENen_US
dc.publisherIEEEen_US
dc.subject.enbandpass filters
dc.subject.encavities
dc.subject.endata-rate
dc.subject.enjitter
dc.subject.enPCB
dc.subject.enreliability
dc.subject.enrepeatability
dc.subject.enSIW
dc.subject.enwireless link
dc.title.en60 GHz SIW Filter with 1.7 dB of Insertion Loss and 7 ps Added Jitter on OOK Modulated Signal
dc.typeCommunication dans un congrès avec actesen_US
dc.identifier.doi10.1109/RWS53089.2022.9719919en_US
dc.subject.halSciences de l'ingénieur [physics]/Electroniqueen_US
bordeaux.page150-152en_US
bordeaux.hal.laboratoriesLaboratoire d’Intégration du Matériau au Système (IMS) - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.titleRadio and Wireless Symposium (RWS)en_US
bordeaux.countryusen_US
bordeaux.title.proceeding2022 IEEE Radio and Wireless Symposium (RWS)en_US
bordeaux.conference.cityLas Vegasen_US
bordeaux.peerReviewedouien_US
bordeaux.import.sourcehal
hal.identifierhal-03651600
hal.version1
hal.exportfalse
workflow.import.sourcehal
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2022&rft.spage=150-152&rft.epage=150-152&rft.au=BERTHIER,%20Alexandre&GHIOTTO,%20Anthony&KERHERVE,%20Eric&VOGT,%20Lionel&rft.genre=proceeding


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