Recherche
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Dynamical behavior of the scanning thermal microscope (SThM) thermal resistive probe studied using Si/SiGe microcoolers
(Superlattices and Microstructures. vol. 38, n° 1, pp. 69-75, 2005-07-06)Article de revue -
Application of Picosecond Ultrasonics to Non-Destructive Defect Analysis in VLSI Circuits
(Microelectronics Reliability. vol. 1, pp. 1, 2003)Article de revue -
Optical techniques for local measurement
(Springer-Verlag Berlin, 2007)Chapitre d'ouvrage -
Thermoreflectance calibration procedure on a laser diode: Application to catastrophic optical facet damage analysis
(IEEE Electron Device Letters. vol. 26, n° 7, pp. 461-463, 2005-07)Article de revue -
Study of thermomechanical properties of Si/SiGe superlattices using femtosecond transient thermoreflectance technique
(Applied Physics Letters. vol. 87, n° 10, pp. 103506 (1-3), 2005-09-05)Article de revue -
Temperature variation mapping of a microelectromechanical system by thermoreflectance imaging
(IEEE Electron Device Letters. vol. 26, n° 2, pp. 78-80, 2005-02)Article de revue -
Localisation of heat sources in electronic circuits by microthermal laser probing
(International Journal of Thermal Sciences. vol. 39, n° 4, pp. 544-549, 2000-04)Article de revue -
Measurement of the thermomechanical strain of electronic devices by shearography
(Microelectronics Reliability. vol. 40, n° 8-10, pp. 1509-1514, 2000-08)Article de revue -
Strain imaging in thermoelectric devices by laser probe shearography
Communication dans un congrès -
Laser Seebeck Effect Imaging (SEI) and Peltier Effect Imaging (PEI): complementary investigation methods
(Microelectronics Reliability. vol. 43, n° 9-11, pp. 1609-1613, 2003-09)Article de revue