Kinematic Fields Measurement during Orthogonal Cutting Using Digital Images Correlation: A Review
Language
EN
Article de revue
This item was published in
International Journal of Manufacturing and Materials Processing. 2021, vol. Vol. 5, n° no. 7, p. 23p.
English Abstract
Understanding the mechanism of chip formation during orthogonal cutting requires a local measurement of the displacement and strain fields in the cutting zone. These measurements can then be used in order to enhance/validate ...Read more >
Understanding the mechanism of chip formation during orthogonal cutting requires a local measurement of the displacement and strain fields in the cutting zone. These measurements can then be used in order to enhance/validate numerical simulation of metal cutting or calibrate material behavior laws for a better prediction of the thermomechanical loads inside the cutting zone. Particle tracking to identify the strain localization that is exhibited in the Adiabatic Shear Band (ASB) is a challenging task. These local measurements can be determined by images post-processing while using the Digital Image Correlation (DIC) technique or analytical models using streamline models or by micro grid analysis. Recently, the use of the DIC technique is widely increased. Texture quality has been shown to be an important factor. Various techniques of surface preparation are then discussed and classified in terms of the created pattern size. Tools for texture analysis are presented. The technique suitability for the kinematic fields measurement while using the DIC technique during machining is discussed. Various optical systems of the literature employed in the context of kinematic fields measurement during machining are discussed in this paper. The recent advances on the design of optical systems are given. Finally, the results of kinematic fields measurement during machining metallic alloys are analyzed.Read less <
English Keywords
orthogonal cutting
surface preparation
texture analysis
high-speed camera
optical devices
kinematic fields measurement
European Project
H2020 Marie Skłodowska-Curie Actions