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A PAE-Controlled Wideband Power Amplifier for Sub-6GHz 5G Applications in 28nm FDSOI Technology
(2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), gb, Glasgow, 2022-12-12)Communication dans un congrès avec actes -
Comparative performance analysis of photo-supercapacitor based on silicon, dye-sensitized and perovskite solar cells: Towards indoor applications
(Solar Energy Materials and Solar Cells. vol. 247, pp. 111966, 2022-10-15)Article de revue -
High-Resolution Fractional Digital Frequency Divider using a Binary-Rate Multiplier
(21st IEEE Interregional NEWCAS Conference (NEWCAS 2023), 21st IEEE Interregional NEWCAS Conference (NEWCAS 2023), gb, Edimbourg, 2023-06-26)Communication dans un congrès avec actes -
Information System Modelling Engineering Design Co-ordination
(Computers in Industry. vol. 53, n° 3, pp. 317-334, 2004)Article de revue -
Un coupleur hybride accordable à ondes lentes CMOS FD-SOI 26-44 GHz 28 nm pour application 5G
Communication dans un congrès -
Study of an Avalanche Compensation Mirror for SiGe High Performance Power Amplifiers dedicated to 5G applications
Communication dans un congrès -
Un amplificateur de puissance Doherty basé sur un coupleur hybride inductif résilient VSWR FD-SOI CMOS 3:1 24-31 GHz 28 nm
Communication dans un congrès -
Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding
(24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)Communication dans un congrès avec actes -
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe
Communication dans un congrès -
Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès