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Comparative performance analysis of photo-supercapacitor based on silicon, dye-sensitized and perovskite solar cells: Towards indoor applications
(Solar Energy Materials and Solar Cells. vol. 247, pp. 111966, 2022-10-15)Article de revue -
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
(Microelectronics Reliability. vol. 143, pp. 114934, 2023-04-01)Article de revue -
Effect of power-assistance on upper limb biomechanical and physiological variables during a 6-minute, manual wheelchair propulsion test: a randomised, cross-over study
(Disability and Rehabilitation. vol. 44, n° 22, pp. 6783-6787, 2022-11-01)Article de revue -
The thermodynamic properties of interstellar isomers with 3 atoms
(Advances in Space Research. vol. 70, n° 11, pp. 3745-3749, 2022-12-01)Article de revue -
A (0.75-1.13)mW and (2.4-5.2)ps RMS jitter Integer-N based Dual-Loop PLL for Indoor and Outdoor Positioning in 28nm FD-SOI CMOS Technology
(IEEE Transactions on Circuits and Systems II: Express Briefs. pp. 1-1, 2023-07-05)Article de revue -
Impacts of additive manufacturing on supply chains: an empirical investigation
(Supply Chain Forum: An International Journal. vol. 24, n° 2, pp. 182-193, 2022-11-11)Article de revue -
Amplificateur de puissance SiGe en bande Ku avec puissance de sortie élevée et robustesse SWR jusqu'à 120 °C
(IEEE Transactions on Circuits and Systems I: Regular Papers. vol. 70, n° 7, pp. 1-8, 2023-05-29)Article de revue -
A Proof-of-Concept of a Multiple-Cell Upsets Detection Method for SRAMs in Space Applications
(IEEE Transactions on Circuits and Systems I: Regular Papers. pp. 1-11, 2023-09-13)Article de revue -
Influence of Losses, Device Size, and Mode Confinement on Integrated Micro-Ring Resonator Performance for Absorption Spectroscopy Using Evanescent Field Sensing
(Journal of Lightwave Technology. vol. 41, n° 5, pp. 1571-1581, 2023-03-01)Article de revue -
Ku Band SiGe Power Amplifier With High Output Power and SWR Robustness Up to 120 °C
(IEEE Transactions on Circuits and Systems I: Regular Papers. vol. 70, n° 7, pp. 2744 - 2751, 2023-01-01)Article de revue