Recherche
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Using X-ray imaging for the study of crack development in solder reliability testing
Communication dans un congrès -
Reliability of the hybrid bonding level using submicrometric bonding pads
Communication dans un congrès -
Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack
Communication dans un congrès -
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits
(Microelectronics Reliability. vol. 143, pp. 114934, 2023-04-01)Article de revue -
Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs
Communication dans un congrès -
A Zero Temperature Coefficient Voltage Reference, Stability and Versatility using 28nm FD-SOI Technology
Actes de congrès/Proceedings -
Proposal and Application of Equivalent MOSFET with different temperature coefficient of threshold voltage
Actes de congrès/Proceedings -
A Walsh-based Arbitrary Waveform Generator for 5G Applications in 28nm FD-SOI CMOS Technology
Communication dans un congrès -
A (0.75-1.13)mW and (2.4-5.2)ps RMS jitter Integer-N based Dual-Loop PLL for Indoor and Outdoor Positioning in 28nm FD-SOI CMOS Technology
(IEEE Transactions on Circuits and Systems II: Express Briefs. pp. 1-1, 2023-07-05)Article de revue