Using X-ray imaging for the study of crack development in solder reliability testing
Language
EN
Communication dans un congrès
This item was published in
Special issue of 34th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2023, ESRF 2023, 2023-10-02, TOULOUSE. 2023-11-03, vol. 150, p. 115079
Elsevier BV
Abstract
The possibility of monitoring the progressive damage and cracking in solder joints is investigated through a non-destructive method. As X-ray 3D Computed Tomography is known to require small sample dimensions in order to ...Read more >
The possibility of monitoring the progressive damage and cracking in solder joints is investigated through a non-destructive method. As X-ray 3D Computed Tomography is known to require small sample dimensions in order to ensure a good resolution, Computed Laminography was used to get a high-resolution top view of various types of solder joints located on a large printed circuit board. In a first step, the assemblies were cross-sectioned after X-ray imaging in order to verify the findings and confirm the crack morphology. Then, by avoiding a destructive sample preparation step, it was possible to identify in a single sample the effects of solder fatigue during a standard reliability test. Firstly, multiple crack initiation sites could be highlighted in a single X-ray analysis. Moreover, the study gave an interesting insight of the time evolution of voids in solder joints. X-ray laminography produces 3D-like images that contain more information than a conventional cross section. By improving the recognition of horizontal cracks in this unusual point of view of solder joints, the refinement of this imaging and monitoring method can result in a real progress in failure analysis time and efficiency.Read less <